公开(公告)号：US20140332947A1

公开(公告)日：2014-11-13

申请号：US14274531

申请日：2014-05-09

Applicant: ANALOG DEVICES, INC.

Inventor： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Richard Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

IPC: H01L23/053 ,  H01L23/10

CPC classification number: H01L23/053 ,  B81B7/0064 ,  B81C1/00269 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Abstract translation: 提供封装的集成器件及其形成方法。 在一个实施例中，封装集成器件包括封装衬底，封装盖以及集成电路或微机电系统（MEMS）器件。 封装盖使用环氧树脂安装到封装基板的第一表面上，封装盖和封装基板限定封装内部。 包装盖包括适合于与环氧树脂的良好粘附性的内部涂层，以及适用于RF屏蔽的外部涂层，其中内部和外部涂层的材料不同。 在一个实例中，内盖涂层是镍，而外盖涂层是锡。

公开(公告)号：US09142470B2

公开(公告)日：2015-09-22

申请号：US14274531

申请日：2014-05-09

Applicant: ANALOG DEVICES, INC.

Inventor： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Richard Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

IPC: H04B1/06 ,  H01L23/053 ,  B81B7/00 ,  B81C1/00 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/053 ,  B81B7/0064 ,  B81C1/00269 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Abstract translation: 提供封装的集成器件及其形成方法。 在一个实施例中，封装集成器件包括封装衬底，封装盖以及集成电路或微机电系统（MEMS）器件。 封装盖使用环氧树脂安装到封装基板的第一表面上，封装盖和封装基板限定封装内部。 包装盖包括适合于与环氧树脂的良好粘附性的内部涂层，以及适用于RF屏蔽的外部涂层，其中内部和外部涂层的材料不同。 在一个实例中，内盖涂层是镍，而外盖涂层是锡。