公开(公告)号：US20240360553A1

公开(公告)日：2024-10-31

申请号：US18765501

申请日：2024-07-08

Applicant: Applied Materials, Inc.

Inventor： Joseph AuBuchon ,  Sanjeev Baluja ,  Ashutosh Agarwal

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01L21/687

CPC classification number: C23C16/4412 ,  C23C16/45551 ,  C23C16/4584 ,  H01L21/68764

Abstract: Processing chambers and methods of use comprising a plurality of processing regions bounded around an outer peripheral edge by one or more vacuum channel. A first processing region has a first vacuum channel with a first outer diameter and a second processing region has a second vacuum channel with a second outer diameter, the first outer diameter being less than the second outer diameter.

公开(公告)号：US11955361B2

公开(公告)日：2024-04-09

申请号：US17686324

申请日：2022-03-03

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Ashutosh Agarwal

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01J37/32715 ,  H01L21/68757

Abstract: Electrostatic chucks (ESCs) for plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a substrate support assembly includes a ceramic top plate having a top surface with a processing region. One or more electrodes is within the ceramic top plate. A plurality of mesas is within the processing region and on the top surface of the ceramic plate or vertically over an edge of one of the one or more electrodes.

公开(公告)号：US11823939B2

公开(公告)日：2023-11-21

申请号：US17480985

申请日：2021-09-21

Applicant: Applied Materials, Inc.

Inventor： Kwok Feng Wong ,  Rakesh Ramadas ,  Ashutosh Agarwal

IPC: H01L21/68 ,  G01B11/24 ,  H01L21/687

CPC classification number: H01L21/681 ,  G01B11/24 ,  H01L21/68735

Abstract: Methods for aligning a processing chamber using a centering ring and processing chambers having the centering ring are describes. The method includes determining an average central position for the centering ring based on the concentricity of the centering with the support surfaces and adjusting average position of centering ring to a final position based on the average central position.

公开(公告)号：US11818810B2

公开(公告)日：2023-11-14

申请号：US17214340

申请日：2021-03-26

Applicant: Applied Materials, Inc.

Inventor： Dhritiman Subha Kashyap ,  Amit Rajendra Sherekar ,  Kartik Shah ,  Ashutosh Agarwal ,  Eric J. Hoffmann ,  Sanjeev Baluja ,  Vijay D. Parkhe

IPC: H05B1/02 ,  H01L21/67

CPC classification number: H05B1/0233 ,  H01L21/67103

Abstract: A heater assembly having a backside purge gap formed between a top plate and a heater of the heater assembly, the top plate having a top plate wall. The top plate wall having an upper portion, a middle portion and a lower portion, the middle portion forming an incline relative to the top portion.

公开(公告)号：US20220282371A1

公开(公告)日：2022-09-08

申请号：US17672520

申请日：2022-02-15

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Ashutosh Agarwal

IPC: C23C16/458 ,  H01L21/683 ,  H01J37/32

Abstract: Electrostatic chucks (ESCs) for plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a substrate support assembly includes a ceramic bottom plate, a ceramic top plate, and a bond layer between the ceramic top plate and the ceramic bottom plate, the ceramic top plate in direct contact with the bond layer, and the bond layer in direct contact with the ceramic bottom plate. A metal shaft is coupled to the ceramic bottom plate at a side of the ceramic bottom plate opposite the bond layer.

公开(公告)号：US12183618B2

公开(公告)日：2024-12-31

申请号：US17061015

申请日：2020-10-01

Applicant: Applied Materials, Inc.

Inventor： Sanjeev Baluja ,  Tejas Ulavi ,  Eric J. Hoffmann ,  Ashutosh Agarwal

IPC: H01L21/687 ,  C23C16/455 ,  C23C16/458

Abstract: Apparatus and methods for loading and unloading substrates from a spatial processing chamber are described. A support assembly has a rotatable center base and support arms extending therefrom. A support shaft is at the outer end of the support arms and a substrate support is on the support shaft. Primary lift pins are positioned within openings in the substrate support. Secondary lift pins are positioned within openings in the support arms and are aligned with the primary lift pins. An actuation plate within the processing volume causes, upon movement of the support assembly, the primary lift pins to elevate through contact with the secondary lift pins.

公开(公告)号：US11932939B2

公开(公告)日：2024-03-19

申请号：US17242898

申请日：2021-04-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Muhammad M. Rasheed ,  Srinivas Gandikota ,  Mario Dan Sanchez ,  Guoqiang Jian ,  Yixiong Yang ,  Deepak Jadhav ,  Ashutosh Agarwal

IPC: C23C16/455 ,  C23C16/44 ,  C23C16/452 ,  H01J37/32

CPC classification number: C23C16/45544 ,  C23C16/4405 ,  C23C16/4408 ,  C23C16/4412 ,  C23C16/452 ,  C23C16/45502 ,  C23C16/45536 ,  C23C16/45565 ,  C23C16/45591 ,  H01J37/32357 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32834

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a lid for a substrate processing chamber includes: a lid plate comprising an upper surface and a contoured bottom surface, the upper surface having a central opening and the contoured bottom surface having a first portion that extends downwardly and outwardly from the central opening to a peripheral portion of the lid plate and a second portion that extends radially outward along the peripheral portion of the lid plate; an upper flange extending radially outward from the lid plate; and one or more channels formed through the lid plate from the upper surface of the lid plate to the second portion of the contoured bottom surface.

公开(公告)号：US20230076170A1

公开(公告)日：2023-03-09

申请号：US17466403

申请日：2021-09-03

Applicant: Applied Materials, Inc.

Inventor： Kenneth Brian Doering ,  Vivek B. Shah ,  Ashutosh Agarwal ,  Sanjeev Baluja ,  Shrihari Sampathkumar ,  Chunlei Zhang

IPC: H01L21/67 ,  H01L21/66

Abstract: Metrology slot plates, processing chamber lids and processing chambers having metrology slot plates are described. Each of the metrology slot plates independently comprises one or more of a plate blank, a reflectometer, a capacitance sensor, a gas flow meter, a manometer, a pyrometer, a distance sensor (laser) or an emissometer.

公开(公告)号：US20230017577A1

公开(公告)日：2023-01-19

申请号：US17948323

申请日：2022-09-20

Applicant: Applied Materials, Inc.

Inventor： Ashutosh Agarwal ,  Sanjeev Baluja

IPC: C23C16/455 ,  H01J37/32

Abstract: Gas distribution apparatus, processing chambers and methods using a dead volume-free valve are described. The valve has a first inlet line with upstream and downstream ends and a second inlet line with a downstream end that connects to the first inlet line. A sealing surface at the downstream end of the second inlet line separates the first inlet line from the second inlet line preventing fluid communication between the first inlet line and the second inlet line.

公开(公告)号：US20220186367A1

公开(公告)日：2022-06-16

申请号：US17120186

申请日：2020-12-13

Applicant: Applied Materials, Inc.

Inventor： Joseph AuBuchon ,  Sanjeev Baluja ,  Ashutosh Agarwal

IPC: C23C16/44 ,  C23C16/458 ,  H01L21/687 ,  C23C16/455

Abstract: Processing chambers and methods of use comprising a plurality of processing regions bounded around an outer peripheral edge by one or more vacuum channel. A first processing region has a first vacuum channel with a first outer diameter and a second processing region has a second vacuum channel with a second outer diameter, the first outer diameter being less than the second outer diameter.