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    METHOD OF FORMING THROUGH HOLE IN INSULATING SUBSTRATE AND METHOD OF MANUFACTURING INSULATING SUBSTRATE FOR INTERPOSER
    1.
    发明申请
    METHOD OF FORMING THROUGH HOLE IN INSULATING SUBSTRATE AND METHOD OF MANUFACTURING INSULATING SUBSTRATE FOR INTERPOSER 审中-公开
    在绝缘基板上形成通孔的方法和制造用于间隔器的绝缘基板的方法

    公开(公告)号：US20140217075A1

    公开(公告)日：2014-08-07

    申请号：US14251883

    申请日：2014-04-14

    Applicant: ASAHI GLASS COMPANY, LIMITED

    Inventor： Shintaro TAKAHASHI ,  Satoshi MORI

    IPC: B44C1/22

    CPC classification number: B44C1/228 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50 ,  B26D7/1845 ,  B26F1/28 ,  H01L21/486 ,  H05K3/0017 ,  H05K3/0029 ,  H05K2201/10378 ,  H05K2203/107

    Abstract: A method including (a) preparing an insulating substrate, and (b) forming n (n is an integer equal to or greater than 9) through holes on the insulating substrate in a through hole density in a range of 1000 pieces/cm2 to 20000 pieces/cm2 at a pitch P (μm) in a range of 20 μm to 300 μm, wherein (b) is performed on a front surface of the insulating substrate and includes (b1) forming a first through hole at a first target position, (b2) forming a second through hole at a second target position, wherein a distance between the first target position and the second target position is greater than the pitch P (μm) . . . , and (bn) forming an n-th final through hole at an n-th target position, wherein a distance between the (n−1) target position and the n-th target position is greater than the pitch P (μm).

    Abstract translation: 一种方法，包括（a）制备绝缘基板，以及（b）通过绝缘基板上的通孔密度在1000个/ cm 2至20000的范围内形成n（n是等于或大于9的整数） 以（μm）的间距P（μm）为20μm〜300μm的片/ cm 2，（b）在绝缘性基板的正面进行，（b1）在第一目标位置形成第一通孔， （b2）在第二目标位置形成第二通孔，其中，所述第一目标位置与所述第二目标位置之间的距离大于所述间距P（μm）。 。 。 ，并且（bn）在第n个目标位置形成第n个最终通孔，其中（n-1）目标位置和第n个目标位置之间的距离大于间距P（μm）。

    METHOD OF MANUFACTURING GLASS COMPONENT, GLASS COMPONENT, AND GLASS INTERPOSER
    4.
    发明申请
    METHOD OF MANUFACTURING GLASS COMPONENT, GLASS COMPONENT, AND GLASS INTERPOSER 有权
    制造玻璃组件，玻璃组件和玻璃间隙的方法

    公开(公告)号：US20150313020A1

    公开(公告)日：2015-10-29

    申请号：US14679237

    申请日：2015-04-06

    Applicant: Asahi Glass Company, Limited

    Inventor： Shintaro TAKAHASHI ,  Motoshi ONO

    IPC: H05K3/00 ,  C03C23/00 ,  H05K1/18 ,  H05K3/06 ,  H05K1/11 ,  C03C15/00 ,  H05K3/40

    CPC classification number: H05K3/007 ,  C03C15/00 ,  C03C23/0025 ,  C03C27/00 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/10378

    Abstract: A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 μm, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 μm and 80 μm, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.

    Abstract translation: 制造玻璃成分的方法包括制备厚度大于或等于300μm的玻璃基板，在玻璃基板的第一表面上形成第一电线，通过将玻璃基板经由树脂层与玻璃基板接合而形成结构 支撑基板，使得玻璃基板的第一表面面向树脂层，将玻璃基板从玻璃基板的第二表面变薄至10μm至80μm的厚度，通过照射玻璃基板形成玻璃基板中的通孔 从激光束的第二表面，在玻璃基板的第二表面上形成第二电线，使得第二电线通过填充通孔的导体与对应的第一电线电连接，并将玻璃基板与 支撑基板。

    METHOD OF MANUFACTURING GLASS SUBSTRATE, AND GLASS SUBSTRATE
    5.
    发明申请
    METHOD OF MANUFACTURING GLASS SUBSTRATE, AND GLASS SUBSTRATE 审中-公开
    制造玻璃基板和玻璃基板的方法

    公开(公告)号：US20140363626A1

    公开(公告)日：2014-12-11

    申请号：US14465675

    申请日：2014-08-21

    Applicant: ASAHI GLASS COMPANY, LIMITED

    Inventor： Shintaro TAKAHASHI ,  Leander Dittmann ,  Adrien Chaize

    IPC: C03B33/08

    CPC classification number: C03B33/08 ,  B26F1/28 ,  B26F1/31 ,  B28D1/221 ,  C03B23/02 ,  Y10T428/24314

    Abstract: A method of manufacturing a glass substrate having a through hole, includes preparing a glass substrate having an average coefficient of thermal expansion in a range of 55×0−7/K to 120×10−7/K at 50° C. to 300° C., and a thickness of 0.2 mm or greater and 1 mm or less, and forming the through hole in the glass substrate using a laser-guided discharge technique.

    Abstract translation: 一种具有通孔的玻璃基板的制造方法，其特征在于，将平均热膨胀系数为55×0-7 / K〜120×10-7 / K的玻璃基板在50℃〜300℃ ℃，厚度为0.2mm以上且1mm以下，并且使用激光引导放电技术在玻璃基板中形成通孔。

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