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公开(公告)号：US3649738A
公开(公告)日：1972-03-14
申请号：US3649738D
申请日：1971-02-16
Applicant: ASEA AB
Inventor： ANDERSSON NILS ERIC , FARKAS TIBOR
IPC: H01L23/36 , H01L23/049 , H01L23/051 , H01L23/467 , H01L23/473 , H01L1/12
CPC classification number: H01L23/473 , H01L23/049 , H01L23/051 , H01L23/467 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
Abstract: A semiconductor system including a semiconductor wafer is provided on at least one side with cooling means formed of a container having a movable wall facing the semiconductor system into which a cooling fluid is fed in such a way as to maintain a substantial pressure in the container to press the movable wall against the semiconductor device.
Abstract translation: 包括半导体晶片的半导体系统在至少一侧上设置有冷却装置，该冷却装置由容器形成，该容器具有面向半导体系统的可移动壁，冷却流体以这样一种方式供入，以便将容器中的实质压力维持在 将可移动的壁压靠在半导体器件上。
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Patent Agency Ranking
公开(公告)号：US3513360A
公开(公告)日：1970-05-19
申请号：US3513360D
申请日：1967-12-26
Applicant: ASEA AB
Inventor： ANDERSSON NILS ERIC , LILJA GORAN
CPC classification number: H01L24/72 , H01L23/16 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/1301 , H01L2924/181 , H01L2924/00
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3.发明授权Semi-conductor device comprising two parallel - connected semi - conductor systems in pressure contact 失效包含两个并联的半导体器件 - 压力接触中的连接半导体系统
公开(公告)号：US3447042A
公开(公告)日：1969-05-27
申请号：US3447042D
申请日：1966-05-31
Applicant: ASEA AB
Inventor： ANDERSSON NILS ERIC
CPC classification number: H01L23/4006 , H01L23/36 , H01L2023/4025 , H01L2924/0002 , H01L2924/00
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4.发明授权Semiconductor device with semiconductor elements arranged side by side and provided with hollow cooling bodies 失效具有半导体元件的半导体器件由侧面安装并具有中空冷却体
公开(公告)号：US3703668A
公开(公告)日：1972-11-21
申请号：US3703668D
申请日：1971-07-09
Applicant: ASEA AB
Inventor： BYLUND PER-AKE , FARKAS TIBOR , ANDERSSON NILS ERIC
IPC: H01L23/473 , H01L25/03 , H01L3/00 , H01L5/00
CPC classification number: H01L23/473 , H01L25/03 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor device comprises semiconductor elements arranged side by side and provided with hollow cooling bodies. The cooling bodies are joined to each other by a connection conduit for the coolant which is flexible and which insulates the cooling bodies from each other electrically. The connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.
Abstract translation: 半导体器件包括并排布置的半导体元件，并且设置有中空冷却体。 冷却体通过用于冷却剂的连接管道彼此连接，冷却剂是柔性的并且使冷却体彼此电绝缘。 连接管道包括绝缘无机材料管和固定到管的每个端部的金属材料的波纹管。
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5.发明授权Semi-conductor device having means pressing a connector into contact with a semi-conductor disc 失效具有连接器连接到半导体盘的连接器的半导体器件
公开(公告)号：US3512053A
公开(公告)日：1970-05-12
申请号：US3512053D
申请日：1968-01-25
Applicant: ASEA AB
Inventor： ANDERSSON NILS ERIC , LILJA GORAN
IPC: H01L23/48 , H01L23/488 , H01L1/14
CPC classification number: H01L24/72 , H01L23/488 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/09701 , H01L2924/1301 , H01L2924/00
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公开(公告)号：US3470405A
公开(公告)日：1969-09-30
申请号：US3470405D
申请日：1967-10-30
Applicant: ASEA AB
Inventor： ANDERSSON NILS ERIC , LILJA GORAN
CPC classification number: H02K11/042
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