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公开(公告)号：US3513360A
公开(公告)日：1970-05-19
申请号：US3513360D
申请日：1967-12-26
Applicant: ASEA AB
Inventor： ANDERSSON NILS ERIC , LILJA GORAN
CPC classification number: H01L24/72 , H01L23/16 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/1301 , H01L2924/181 , H01L2924/00
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2.发明授权Semi-conductor device having means pressing a connector into contact with a semi-conductor disc 失效具有连接器连接到半导体盘的连接器的半导体器件
公开(公告)号：US3512053A
公开(公告)日：1970-05-12
申请号：US3512053D
申请日：1968-01-25
Applicant: ASEA AB
Inventor： ANDERSSON NILS ERIC , LILJA GORAN
IPC: H01L23/48 , H01L23/488 , H01L1/14
CPC classification number: H01L24/72 , H01L23/488 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/09701 , H01L2924/1301 , H01L2924/00
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公开(公告)号：US3470405A
公开(公告)日：1969-09-30
申请号：US3470405D
申请日：1967-10-30
Applicant: ASEA AB
Inventor： ANDERSSON NILS ERIC , LILJA GORAN
CPC classification number: H02K11/042
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