SUBSTRATE TRANSFER DEVICE, NOTCH POSITION CORRECTION METHOD, SUBSTRATE TRANSFER METHOD, AND STORAGE MEDIUM

    公开(公告)号:US20250118584A1

    公开(公告)日:2025-04-10

    申请号:US18905937

    申请日:2024-10-03

    Inventor: Masashi Nakano

    Abstract: Examples of a substrate transfer device includes a load lock chamber (LLC), a first wafer handling chamber (WHC), a first transfer robot fixed at a first attachment position in the first WHC, a pass through chamber (PTC) that is in contact with the first WHC, a substrate stage provided in the PTC, a second WHC that is in contact with the PTC, and a second transfer robot fixed at a second attachment position in the second WHC. A first angle that is an angle formed by a first virtual line that connects the first attachment position and the second attachment position and a second virtual line that connects the first attachment position and the substrate stage is equal to a second angle that is an angle formed by the first virtual line and a third virtual line that connects the second attachment position and the substrate stage.

    INTERFACE MODULE HAVING FAN FILTER UNIT
    3.
    发明公开

    公开(公告)号:US20230332791A1

    公开(公告)日:2023-10-19

    申请号:US18302110

    申请日:2023-04-18

    CPC classification number: F24F11/50 H01L21/67017 F24F11/0001

    Abstract: Examples of an interface module include a fan filter unit including a fan and a filter, a housing surrounding a space adjacent to the filter, a discharge system attached to the housing, a substrate support instrument provided in the housing, an upper housing surrounding a space adjacent to the fan, a gas supply system attached to the upper housing, a circulation duct connected to the housing and the upper housing, and a radiator provided between the fan and the filter.

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