METHOD OF FORMING A LAYER BY ALD
    1.
    发明申请

    公开(公告)号:US20240425984A1

    公开(公告)日:2024-12-26

    申请号:US18748983

    申请日:2024-06-20

    Abstract: A method of forming a layer of a material on one or more substrates by ALD is disclosed. Embodiments of the presently described method comprise performing a plurality of deposition cycles comprising at least two precursors pulses with intervening purge pulses to form the layer of the material on the one or more substrates. During each deposition cycle, a ratio of the process chamber pressure during each precursor pulse of the at least two precursor pulses to the process chamber pressure during an intervening purge pulse is equal or different from one another.

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