公开(公告)号：US20230187260A1

公开(公告)日：2023-06-15

申请号：US18078229

申请日：2022-12-09

Applicant: ASM IP Holding B.V.

Inventor： Wonki Jeong ,  DaeYoun Kim ,  DongJun Park

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785 ,  H01L21/68757

Abstract: In one embodiment according to the disclosure, an apparatus for manipulating substrates in semiconductor processing comprising a plurality of lift pins, comprising a top end and a down end, and configured for the top end can move upward to an UP position and move downward to a DOWN position, wherein the top end supports a wafer, a weight comprising a plurality of lift pin holes and is configured to connect the plurality of lift pins and a plurality of weight supports, each of them are configured to attach to the plurality of lift pins respectively and each of them are to be placed in the plurality of lift pin holes respectively is presented. The embodiment can improve the semiconductor processing efficiency by preventing the lift pins from getting stuck.