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公开(公告)号:US20210072654A1
公开(公告)日:2021-03-11
申请号:US17054313
申请日:2019-05-02
Applicant: ASML Holding N.V.
Inventor: David TAUB , Joseph Ashwin FRANKLIN , Jeffrey John KOWALSKI
Abstract: A lithography system comprises an illumination system configured to produce abeam of radiation, a support configured to support a patterning device configured to impart a pattern on the beam, a projection system configured to project the patterned beam onto a substrate, and an alignment system comprising an illuminator. The illuminator comprises an optical fiber, an optical fiber protector (714), an optical fiber support (700) comprising a first support arm assembly configured to support the optical fiber protector, an optical system, and an optical system support comprising a second support arm assembly configured to support the optical system.
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公开(公告)号:US20190219927A1
公开(公告)日:2019-07-18
申请号:US16331710
申请日:2017-09-04
Applicant: ASML Netherlands B. V. , ASML Holding N.V.
Inventor: Suzanne Johanna Antonetta Geertruda COSIJNS , Maarten VAN DER HEIJDEN , Frederikus Johannes Maria DE VREEDE , David TAUB , Eric EMERY , Joseph Ashwin FRANKLIN
CPC classification number: G03F7/7095 , G03F7/70825 , G03F7/7085 , G03F9/7096
Abstract: An alignment system configured to be substantially insensitive to thermal variations in its system during alignment measurements. The alignment system includes a sensor system, a support structure, a sensing element, a position measurement system, and an athermal interface between the sensing element and the support structure. The sensor system is configured to determine a in position of an alignment mark on a substrate and the support structure is configured to support the sensor system. The sensing element is configured to detect an unintentional displacement of the support structure and the position measurement system is configured to measure the unintentional displacement relative to a reference element based on the detected unintentional displacement. The athermal interface is configured to prevent detection of temperature induced displacement of the support structure by the sensing element.
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