公开(公告)号：US20210202293A1

公开(公告)日：2021-07-01

申请号：US16756907

申请日：2018-10-04

Applicant: ASML HOLDING N.V.

Inventor： Mehmet Ali AKBAS ,  David Hart PETERSON ,  Tammo UITTERDIJK ,  Michael PERRY ,  Richard Bryan LEWIS ,  Iliya SIGAL

IPC: H01L21/687 ,  G03F7/20

Abstract: Various burl designs for holding an object in a lithographic apparatus are described. A lithographic apparatus includes an illumination system, a first support structure, a second support structure, and a projection system. The illumination system is designed to receive radiation and to direct the radiation towards a patterning device that forms patterned radiation. The first support structure is designed to support the patterning device on the first support structure. The second support structure has a plurality of burls and is designed to support the substrate on the plurality of burls. A topography of a top surface of each of the plurality of burls is not substantially flat, such that a contact area between the substrate and each of the plurality of burls is reduced. The projection system is designed to receive the patterned radiation and to direct the patterned radiation towards the substrate.

公开(公告)号：US20230031443A1

公开(公告)日：2023-02-02

申请号：US17788806

申请日：2020-12-08

Applicant: ASML Holding N.V.

Inventor： Matthew LIPSON ,  Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Fei ZHAO

IPC: G03F7/20

Abstract: Systems, apparatuses, and methods are provided for manufacturing a wafer clamp having hard burls. The method can include providing a first layer that includes a first surface. The method can further include forming a plurality of burls over the first surface of the first layer. The forming of the plurality of burls can include forming a subset of the plurality of burls to a hardness of greater than about 6.0 gigapascals (GPa).

公开(公告)号：US20180321602A1

公开(公告)日：2018-11-08

申请号：US15764594

申请日：2016-10-05

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Raymond Wilhelmus Louis LAFARRE ,  Adrianus Hendrik KOEVOETS ,  Michael Leo NELSON ,  Jacobus Cornelis Gerardus VAN DER SANDEN ,  Geoffrey O'CONNOR ,  Michael Andrew CHIEDA ,  Tammo UITTERDIJK

IPC: G03F7/20 ,  H01L21/683

CPC classification number: G03F7/70875 ,  G03F7/707 ,  G03F7/70783 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/6831

Abstract: A lithographic apparatus includes a clamp (406) configured to receive an object (402). The clamp defines at least one channel (408) configured to pass a fluid at a first fluid temperature. The lithographic apparatus also includes a chuck (404) coupled to the clamp. The chuck (404) defines at least one void (464) configured to thermally insulate the chuck from the clamp.

公开(公告)号：US20230384694A1

公开(公告)日：2023-11-30

申请号：US18269387

申请日：2021-12-02

Applicant: ASML Netherlands B.V. ,  ASML Holding N.V.

Inventor： Abdullah ALIKHAN ,  Tammo UITTERDIJK ,  Johannes Bernardus Charles ENGELEN ,  Daniel KAMIENIECKI ,  Bastiaan Lambertus Wilhelmus Marinus VAN DE VEN ,  Thomas POIESZ ,  Leon Martin LEVASIER ,  Jim Vincent OVERKAMP ,  Johannes Adrianus Cornelis Maria PIJNENBURG ,  Koos VAN BERKEL ,  Gregory James DIGUIDO ,  Anthony C. SOCCI, JR. ,  Iliya SIGAL ,  Bram Antonius Gerardus LOMANS ,  Michel Ben Isel HABETS

IPC: G03F7/00 ,  H01L21/683 ,  H01L21/687

CPC classification number: G03F7/70708 ,  G03F7/7095 ,  G03F7/70783 ,  H01L21/6838 ,  H01L21/68757

Abstract: Systems, apparatuses, and methods are provided for manufacturing a substrate table. An example method can include forming a vacuum sheet including a plurality of vacuum connections and a plurality of recesses configured to receive a plurality of burls disposed on a core body for supporting an object such as a wafer. Optionally, at least one burl can be surrounded, partially or wholly, by a trench. The example method can further include using the vacuum sheet to mount the core body to an electrostatic sheet including a plurality of apertures configured to receive the plurality of burls. Optionally, the example method can include using the vacuum sheet to mount the core body to the electrostatic sheet such that the plurality of recesses of the vacuum sheet line up with the plurality of burls of the core body and the plurality of apertures of the electrostatic sheet.

公开(公告)号：US20230314962A1

公开(公告)日：2023-10-05

申请号：US18012317

申请日：2021-06-04

Applicant: ASML Holding N.V.

Inventor： Tammo UITTERDIJK

IPC: G03F7/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: G03F7/70783 ,  G03F7/70708 ,  H01L21/67288 ,  H01L21/6831

Abstract: Systems, apparatuses, methods, and computer program products are provided for determining a free form flatness of a substrate table. An example system can include a substrate table that includes a first substrate table surface and a grounded substrate table electrical connection configured to ground the substrate table. The system can further include a substrate that includes a semiconducting layer, a thermally-grown insulating layer, a first substrate surface disposed on the insulating layer, and a substrate electrical connection configured to transmit a voltage to the semiconducting layer. The system can further include a metrology system configured to apply a voltage to the substrate electrical connection to electrostatically clamp the substrate to the substrate table, measure a flatness of the first substrate surface, and determine a free form flatness of the first substrate table surface based on the measured flatness of the first substrate surface.

公开(公告)号：US20210405539A1

公开(公告)日：2021-12-30

申请号：US17291086

申请日：2019-10-22

Applicant: ASML Holding N.V.

Inventor： Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Christopher John MASON ,  Matthew LIPSON ,  David Hart PETERSON ,  Michael PERRY ,  Peter HELMUS ,  Jerry Jianguo DENG ,  Damoon SOHRABIBABAHEIDARY

IPC: G03F7/20 ,  H01L21/687

Abstract: A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.

公开(公告)号：US20230236518A1

公开(公告)日：2023-07-27

申请号：US18008283

申请日：2021-06-09

Applicant: ASML Netherlands B.V. ,  ASML HOLDING N.V.

Inventor： Bastiaan Lambertus Wilhelmus Marinus VAN DE VEN ,  Koos VAN BERKEL ,  Marcus Adrianus VAN DE KERKHOF ,  Roger Franciscus Mattheus Maria HAMELINCK ,  Shahab SHERVIN ,  Marinus Augustinus Christiaan VERSCHUREN ,  Johannes Bernardus Charles ENGELEN ,  Matthias KRUIZINGA ,  Tammo UITTERDIJK ,  Oleksiy Sergiyovich GALAKTIONOV ,  Kjeld Gertrudus Hendrikus JANSSEN ,  Johannes Adrianus Cornelis Maria PIJNENBURG ,  Peter VAN DELFT

IPC: G03F7/00

CPC classification number: G03F7/70825 ,  G03F7/70708

Abstract: An object holder configured to support an object, the object holder comprising: a core body comprising a plurality of burls having distal ends in a support plane for supporting the object; an electrostatic sheet between the burls, the electrostatic sheet comprising an electrode sandwiched between dielectric layers; and a circumferential barrier for reducing outflow of gas escaping from space between the object and the core body.

公开(公告)号：US20170242345A1

公开(公告)日：2017-08-24

申请号：US15504749

申请日：2015-07-09

Applicant: ASML Holding N.V.

Inventor： Matthew LIPSON ,  Vincent DIMILIA ,  Ronald Peter TOTILLO ,  Tammo UITTERDIJK ,  Steven Michael ZIMMERMAN

IPC: G03F7/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: G03F7/70708 ,  C03B23/20 ,  C03B25/02 ,  G03F7/70783 ,  G03F7/70875 ,  G03F7/7095 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833

Abstract: An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.

公开(公告)号：US20240369947A1

公开(公告)日：2024-11-07

申请号：US18773176

申请日：2024-07-15

Applicant: ASML Holding N.V.

Inventor： Mehmet Ali AKBAS ,  Tammo UITTERDIJK ,  Christopher John MASON ,  Matthew LIPSON ,  David Hart PETERSON ,  Michael PERRY ,  Peter HELMUS ,  Jerry Jianguo DENG ,  Damoon SOHRABIBABAHEIDARY

IPC: G03F7/00 ,  H01L21/687

Abstract: A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.

公开(公告)号：US20240248415A1

公开(公告)日：2024-07-25

申请号：US18562770

申请日：2022-04-28

Applicant: ASML Holding N.V. ,  ASML Netherlands B.V.

Inventor： Shahab SHERVIN ,  Tammo UITTERDIJK ,  Matthew LIPSON ,  Marcus Martinus Petrus Adrianus VERMEULEN

IPC: G03F7/00 ,  H01L21/687

CPC classification number: G03F7/707 ,  G03F7/7095 ,  G03F7/70975 ,  H01L21/6875

Abstract: The present disclosure is directed to a modular wafer table and methods for refurbishing a scrapped wafer to manufacture the modular wafer table. The method comprises removing one or more burls from a surface of a wafer table; polishing the surface of the wafer table after removing the one or more burls to form a core module; forming a burl module having a plurality of burls thereon; and bonding the core module to the burl module.