公开(公告)号：US20240231233A9

公开(公告)日：2024-07-11

申请号：US18277223

申请日：2022-02-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Niek Willem KLEIN KOERKAMP ,  Marc HAUPTMANN ,  Aliasghar KEYVANI JANBAHAN ,  Jingchao WANG

IPC: G03F7/20 ,  H01L21/66

CPC classification number: G03F7/20 ,  H01L22/10

Abstract: Methods and apparatus for characterizing a semiconductor manufacturing process performed on a substrate. First data is obtained associated with fingerprint data of the substrate measured after a first processing step. Second data is obtained associated with fingerprint data of the substrate measured after a second processing step. A statistical model is used to decompose the first and second data into a first class of fingerprint components mutually correlating between the first and second data and a second class of fingerprint components not mutually correlating between the first and second data. At least one of the first class fingerprint of components and the second class of fingerprint components are used to characterize the semiconductor manufacturing process.

公开(公告)号：US20240134283A1

公开(公告)日：2024-04-25

申请号：US18277223

申请日：2022-02-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Niek Willem KLEIN KOERKAMP ,  Marc HAUPTMANN ,  Aliasghar KEYVANI JANBAHAN ,  Jingchao WANG

IPC: G03F7/20 ,  H01L21/66

CPC classification number: G03F7/20 ,  H01L22/10

Abstract: Methods and apparatus for characterizing a semiconductor manufacturing process performed on a substrate. First data is obtained associated with fingerprint data of the substrate measured after a first processing step. Second data is obtained associated with fingerprint data of the substrate measured after a second processing step. A statistical model is used to decompose the first and second data into a first class of fingerprint components mutually correlating between the first and second data and a second class of fingerprint components not mutually correlating between the first and second data. At least one of the first class fingerprint of components and the second class of fingerprint components are used to characterize the semiconductor manufacturing process.