公开(公告)号：US20230275117A1

公开(公告)日：2023-08-31

申请号：US18161383

申请日：2023-01-30

Applicant: AUO Corporation

Inventor： Bin-Cheng LIN ,  Bo-Ru Jian ,  Chi-Sheng Liao ,  Ta-Wen Liao

IPC: H01L27/15 ,  H01L33/00

CPC classification number: H01L27/156 ,  H01L33/0095

Abstract: A display panel includes a substrate, an LED array disposed on the front side of the substrate, a driving circuit disposed on the front side of the substrate and connected to the LED array, a connecting line and a transparent conductive layer disposed on the back side of the substrate. The connecting line is spaced apart with a side surface of the substrate thereby defining a cutting area. The transparent conductive layer extends from the cutting area and at least partially covering the connecting line. The display panel further includes a first passivation layer and a conductive layer. The first passivation layer is disposed on the transparent conductive layer and the connecting line. The side surfaces of the first passivation layer, the transparent conductive layer, and the substrate are aligned. The conductive layer penetrates the first passivation layer to connect the transparent conductive layer to the driving circuit.

公开(公告)号：US20230276580A1

公开(公告)日：2023-08-31

申请号：US18169724

申请日：2023-02-15

Applicant: AUO Corporation

Inventor： Chi-Sheng LIAO ,  Bo-Ru JIAN ,  Bin-Cheng LIN ,  Ta-Wen LIAO

IPC: H05K3/46 ,  H05K3/28 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K3/4679 ,  H05K1/036 ,  H05K3/282 ,  H05K3/4007 ,  H05K3/4046 ,  H05K2201/10128

Abstract: A circuit board structure for a display device includes a substrate, a bump, a protective layer, and a moisture-resistant layer. The substrate includes a first surface and a second surface opposite to the first surface. The bump is disposed on the first surface of the substrate and includes a first inorganic material. The protective layer is disposed on the first surface of the substrate. The protective layer includes an organic material and a first opening, in which the bump is positioned in the first opening. The moisture-resistant layer entirely covers the protective layer. The moisture-resistant layer includes a second inorganic material and a second opening, in which a portion of the bump is exposed in the second opening.

公开(公告)号：US20240234652A9

公开(公告)日：2024-07-11

申请号：US18489890

申请日：2023-10-19

Applicant: AUO Corporation

Inventor： Bin-Cheng LIN ,  Chieh-Ming Chen ,  Bo-Ru Jian ,  Chi-Sheng Liao ,  Ta-Wen Liao

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/54

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/54

Abstract: A micro light-emitting diode display device includes a substrate, a first planarization layer, a first light-emitting element, and a second planarization layer. The first planarization layer is disposed on the substrate and has a first opening. The first opening has a first opening inner wall. The first light-emitting element is disposed on the substrate, in the first opening, and separated from the first opening inner wall. The second planarization layer is disposed on the substrate and between the first planarization layer and the first light-emitting element. The second planarization layer is in contact with the first light-emitting element.

公开(公告)号：US20240136481A1

公开(公告)日：2024-04-25

申请号：US18489890

申请日：2023-10-18

Applicant: AUO Corporation

Inventor： Bin-Cheng LIN ,  Chieh-Ming Chen ,  Bo-Ru Jian ,  Chi-Sheng Liao ,  Ta-Wen Liao

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/54

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/54

Abstract: A micro light-emitting diode display device includes a substrate, a first planarization layer, a first light-emitting element, and a second planarization layer. The first planarization layer is disposed on the substrate and has a first opening. The first opening has a first opening inner wall. The first light-emitting element is disposed on the substrate, in the first opening, and separated from the first opening inner wall. The second planarization layer is disposed on the substrate and between the first planarization layer and the first light-emitting element. The second planarization layer is in contact with the first light-emitting element.