公开(公告)号：US20250048548A1

公开(公告)日：2025-02-06

申请号：US18228366

申请日：2023-07-31

Applicant: AVISHTECH, INC.

Inventor： Tarun Amla ,  Keshav Amla ,  Jyoti Amla

IPC: H05K1/03

Abstract: Dielectric material layers including thermoplastic liquid crystal polymer (LCP) substrates coated or impregnated with a thermosetting resin. The dielectric material layers may have a dielectric constant (DK) value of less than about 3.4 and a dissipation factor of less than about 0.005 for use in printed circuit boards. The dielectric material layers may find particular utility in high density interconnect (HDI) printed circuit boards.

公开(公告)号：US20240341032A1

公开(公告)日：2024-10-10

申请号：US18130768

申请日：2023-04-04

Applicant: AVISHTECH, INC.

Inventor： Tarun Amla ,  Keshav Amla ,  Jyoti Amla

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/0293 ,  H05K2201/068

Abstract: Dielectric materials including non-woven inorganic fabrics impregnated with a low-density resin are disclosed. The dielectric materials may have a thickness in a range of about 5 to about 125 microns for use in printed circuit boards.