公开(公告)号：US20240249996A1

公开(公告)日：2024-07-25

申请号：US18099949

申请日：2023-01-22

Applicant: Advanced Micro Devices, Inc.

Inventor： Michael FLYNN ,  Otto JOE

IPC: H01L23/42 ,  H01L21/48 ,  H01L23/00 ,  H01L23/367 ,  H01L25/065

CPC classification number: H01L23/42 ,  H01L21/4817 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311

Abstract: A method and apparatus are provided which manages the movement of thermal interface material (TIM) squeezed out from between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes an IC die mounted on a substrate and covered by a lid. A bottom surface of the lid has a die overlapped region facing a top surface of the IC die. The bottom surface of the lid has a first gutter formed therein. An outer sidewall of the first gutter is formed outward of the first die overlapped region as to receive TIM squeezed out from between a lid and an IC die.