公开(公告)号：US20200328322A1

公开(公告)日：2020-10-15

申请号：US16384847

申请日：2019-04-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Chen TSAI ,  Lu-Ming LAI ,  Hsun-Wei CHAN ,  Ying-Chung CHEN

IPC: H01L31/12 ,  H01L31/0232 ,  H01L31/0203

Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.