公开(公告)号：US20200243408A1

公开(公告)日：2020-07-30

申请号：US16851006

申请日：2020-04-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/053 ,  H01L21/50 ,  H01L33/48 ,  H01L23/04

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20220208623A1

公开(公告)日：2022-06-30

申请号：US17695757

申请日：2022-03-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/053 ,  H01L21/50 ,  H01L33/48 ,  H01L23/04

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20240145319A1

公开(公告)日：2024-05-02

申请号：US18402661

申请日：2024-01-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L21/50 ,  H01L23/00 ,  H01L23/04 ,  H01L23/053 ,  H01L33/48

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L23/04 ,  H01L23/053 ,  H01L24/48 ,  H01L33/486 ,  G01L19/14 ,  H01L24/16 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/1659 ,  H01L2924/17151

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20180190553A1

公开(公告)日：2018-07-05

申请号：US15844276

申请日：2017-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/053 ,  H01L23/00

CPC classification number: H01L23/10 ,  G01L19/14 ,  H01L21/50 ,  H01L23/04 ,  H01L23/053 ,  H01L24/16 ,  H01L24/48 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/1659 ,  H01L2924/17151 ,  H01L2224/45099 ,  H01L2224/13099

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.