公开(公告)号：US20200243408A1

公开(公告)日：2020-07-30

申请号：US16851006

申请日：2020-04-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/053 ,  H01L21/50 ,  H01L33/48 ,  H01L23/04

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20240145319A1

公开(公告)日：2024-05-02

申请号：US18402661

申请日：2024-01-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L21/50 ,  H01L23/00 ,  H01L23/04 ,  H01L23/053 ,  H01L33/48

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L23/04 ,  H01L23/053 ,  H01L24/48 ,  H01L33/486 ,  G01L19/14 ,  H01L24/16 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/1659 ,  H01L2924/17151

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20180190553A1

公开(公告)日：2018-07-05

申请号：US15844276

申请日：2017-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/053 ,  H01L23/00

CPC classification number: H01L23/10 ,  G01L19/14 ,  H01L21/50 ,  H01L23/04 ,  H01L23/053 ,  H01L24/16 ,  H01L24/48 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/1659 ,  H01L2924/17151 ,  H01L2224/45099 ,  H01L2224/13099

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20220208623A1

公开(公告)日：2022-06-30

申请号：US17695757

申请日：2022-03-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu LIN ,  Pei-Yu WANG ,  Chung-Wei HSU

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/053 ,  H01L21/50 ,  H01L33/48 ,  H01L23/04

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US20180315894A1

公开(公告)日：2018-11-01

申请号：US15909884

申请日：2018-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Tsung-Yu LIN

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/02

Abstract: A semiconductor device package includes a carrier, a semiconductor device disposed on the carrier, and a lid disposed on the semiconductor device. The lid is spaced from the carrier by a first distance. The lid includes a base portion, a first pin extending from the base portion toward the semiconductor device, and a transparent portion. The first pin is spaced from the carrier by a second distance.

公开(公告)号：US20170207352A1

公开(公告)日：2017-07-20

申请号：US15347664

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Chia Yun HSU ,  Tsung-Yu LIN

IPC: H01L31/0232 ,  G01J1/02 ,  H01L31/18 ,  H01L31/12 ,  H01L31/0203 ,  F21V8/00 ,  G01J1/04

CPC classification number: H01L31/02327 ,  G01J1/0209 ,  G01J1/0425 ,  G02B6/0028 ,  G06K9/00046 ,  H01L31/0203 ,  H01L31/125 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.