公开(公告)号：US20160187530A1

公开(公告)日：2016-06-30

申请号：US14975036

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ruei-Bin MA ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: G01V8/12 ,  H01L31/18 ,  H01L31/167 ,  H01L25/16 ,  H01L31/0232

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space.

Abstract translation: 光学模块包括载体，设置在载体上的发光部件，设置在载体上的光学传感器，壳体和透镜。 壳体设置在载体上并且包围发光部件和光学传感器。 壳体限定第一容纳空间，其包括第一孔和位于第一孔下方的第二孔。 壳体包括围绕第一孔的第一侧壁，围绕第二孔的第二侧壁和第一支撑部分，其中第一侧壁的底端和第二侧壁的顶端相交。 透镜位于第一孔中并由第一支撑部分支撑。 发光组件或光学传感器中的一个位于第一容纳空间中。