公开(公告)号：US20210257246A1

公开(公告)日：2021-08-19

申请号：US16791938

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Ling MA ,  Ying-Chung CHEN ,  Hsin-Ying HO ,  Cheng-Ling HUANG ,  Chang Chin TSAI

IPC: H01L21/683 ,  H01L21/82 ,  H01L31/18 ,  H01L33/00

Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.