公开(公告)号：US20240219641A1

公开(公告)日：2024-07-04

申请号：US18092146

申请日：2022-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling HUANG ,  Ying-Chung CHEN

IPC: G02B6/293

CPC classification number: G02B6/29301

Abstract: An optical module is disclosed. The optical module includes a carrier and a lid disposed over the carrier. The carrier and the lid are collaboratively define a first cavity for accommodating a photonic component. The optical module also includes a first electrical contact disposed over a first side of the lid and configured to provide an electronic connection for the optical module. A first aperture penetrating the lid is formed at the first side of the lid and corresponds to a light transmission/reception area of the photonic component.

公开(公告)号：US20180358501A1

公开(公告)日：2018-12-13

申请号：US15619414

申请日：2017-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling HUANG ,  Ying-Chung CHEN

IPC: H01L31/16 ,  A61B5/00 ,  A61B5/0408

CPC classification number: H01L31/16 ,  A61B5/0082 ,  A61B5/0408 ,  A61B2562/0209 ,  A61B2562/0238 ,  A61B2562/06 ,  A61B2562/185

Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.

公开(公告)号：US20220115425A1

公开(公告)日：2022-04-14

申请号：US17066412

申请日：2020-10-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling HUANG ,  Lu-Ming LAI ,  Ying-Chung CHEN

IPC: H01L27/146

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

公开(公告)号：US20210257246A1

公开(公告)日：2021-08-19

申请号：US16791938

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Ling MA ,  Ying-Chung CHEN ,  Hsin-Ying HO ,  Cheng-Ling HUANG ,  Chang Chin TSAI

IPC: H01L21/683 ,  H01L21/82 ,  H01L31/18 ,  H01L33/00

Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.

公开(公告)号：US20210036658A1

公开(公告)日：2021-02-04

申请号：US17074618

申请日：2020-10-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Hui-Chung LIU ,  Kuo-Hua LAI ,  Cheng-Ling HUANG

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.