公开(公告)号：US20220373670A1

公开(公告)日：2022-11-24

申请号：US17324965

申请日：2021-05-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Chung Ju YU ,  Wei-Fan WU ,  Chai-Chi LIN ,  Hong Jie CHEN

IPC: G01S13/58 ,  H01L25/16 ,  H01Q1/27

Abstract: At least some embodiments of the present disclosure relate to a wearable device. The wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically connected to the detecting module. The control module is configured to receive a signal from the detecting module and to control the wearable device in response to the signal.