公开(公告)号：US10034372B1

公开(公告)日：2018-07-24

申请号：US15670908

申请日：2017-08-07

Applicant: Amkor Technology, Inc.

Inventor： Akito Yoshida ,  Mahmoud Dreiza ,  Curtis Michael Zwenger

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H05K1/18 ,  H05K3/36 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A

公开(公告)号：US20200337152A1

公开(公告)日：2020-10-22

申请号：US16774233

申请日：2020-01-28

Applicant: Amkor Technology, Inc.

Inventor： Akito Yoshida ,  Mahmoud Dreiza ,  Curtis Michael Zwenger

IPC: H05K1/14 ,  H01L23/31 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H05K3/36 ,  H05K3/40

Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A

公开(公告)号：US10548221B1

公开(公告)日：2020-01-28

申请号：US16272135

申请日：2019-02-11

Applicant: Amkor Technology, Inc.

Inventor： Akito Yoshida ,  Mahmoud Dreiza ,  Curtis Michael Zwenger

IPC: H05K3/44 ,  H05K1/18 ,  H05K1/14 ,  H01L23/31 ,  H01L21/56 ,  H05K3/36 ,  H01L23/00 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40

Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A

公开(公告)号：US10257942B1

公开(公告)日：2019-04-09

申请号：US13896710

申请日：2013-05-17

Applicant: Amkor Technology, Inc.

Inventor： Akito Yoshida ,  Mahmoud Dreiza

IPC: H05K3/42

Abstract: A stackable variable height via package includes a substrate having a first surface and terminals thereon. The terminals include a first terminal and a second terminal. Vias are on the terminals, the vias including a first via on the first terminal and a second via on the second terminal. The first via has a height from the first surface of the substrate less than a height of the second via from the first surface of the substrate. The package further includes a package body and via apertures in the package body to expose the vias. Forming the stackable variable height via package with variable height vias readily accommodate stacking of additional packages having different types of terminals, e.g., LGA and BGA type packages, as well as variable degrees of warpage on the stackable variable height via package. Further, the vias are formed with a minimum pitch.

公开(公告)号：US09730327B1

公开(公告)日：2017-08-08

申请号：US14657032

申请日：2015-03-13

Applicant: Amkor Technology, Inc.

Inventor： Akito Yoshida ,  Mahmoud Dreiza ,  Curtis Michael Zwenger

IPC: H05K1/18 ,  H05K3/36 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/16055 ,  H01L2224/1607 ,  H01L2224/16113 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01079 ,  H05K1/14 ,  H05K1/181 ,  H05K1/184 ,  H05K1/185 ,  H05K3/303 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/10515 ,  H05K2201/10977 ,  H05K2203/043 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A

公开(公告)号：US10206285B1

公开(公告)日：2019-02-12

申请号：US16042312

申请日：2018-07-23

Applicant: Amkor Technology, Inc.

Inventor： Akito Yoshida ,  Mahmoud Dreiza ,  Curtis Michael Zwenger

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H05K3/34 ,  H05K3/30 ,  H05K1/18 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H05K3/36 ,  H01L21/56

Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A

公开(公告)号：US09012789B1

公开(公告)日：2015-04-21

申请号：US14246286

申请日：2014-04-07

Applicant: Amkor Technology, Inc.

Inventor： Akito Yoshida ,  Mahmoud Dreiza ,  Curtis Michael Zwenger

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/16055 ,  H01L2224/1607 ,  H01L2224/16113 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01079 ,  H05K1/14 ,  H05K1/181 ,  H05K1/184 ,  H05K1/185 ,  H05K3/303 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/10515 ,  H05K2201/10977 ,  H05K2203/043 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: An electronic component assembly and a method for making an electronic component assembly. A non-limiting example electronic component assembly may, for example, comprise a lower component comprising a plurality of upward extending pins, and an upper component comprising a plurality of respective terminals, each which comprising a respective reflowable conductive structure that extends downward to a respective one of the plurality of upward extending pins.

Abstract translation: 电子部件组件和用于制造电子部件组件的方法。 非限制性示例性电子部件组件可以例如包括包括多个向上延伸的销的下部部件和包括多个相应端子的上部部件，每个端部包括相应的可回流导电结构，其向下延伸到相应的 多个向上延伸的销之一。