公开(公告)号：US09513254B2

公开(公告)日：2016-12-06

申请号：US14455975

申请日：2014-08-11

Applicant: Amkor Technology, Inc.

Inventor： Hyung II Jeon ,  Ji Young Chung ,  Chan Ha Hwang ,  Byong Jin Kim ,  Yung Woo Lee ,  Do Hyun Na ,  Jae Ung Lee

IPC: B01L3/00 ,  G01N33/487 ,  H01L23/433 ,  G01N27/447 ,  H01L23/34

CPC classification number: G01N27/44791 ,  B01L3/502707 ,  B01L3/502715 ,  B01L3/50273 ,  B01L3/502761 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0858 ,  B01L2400/0406 ,  B01L2400/0415 ,  G01N33/48707 ,  G01N33/48721 ,  H01L23/4334 ,  H01L2924/0002 ,  Y10T29/4913 ,  H01L2924/00

Abstract: In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.

Abstract translation: 在一个实施例中，微流体传感器装置包括安装在微引线框架基板上并电连接微引线框架基板的微流体传感器。 微流体传感器被模制以形成包装体。 封装主体包括模制板部分，并且在一些实施例中，具有一个或多个开放通道，密封通道的掩模部分和/或暴露微流体传感器的有效表面的密封室。 模制板部分和掩模部分被配置成允许材料动态地或静态地接触微流体传感器用于分析。