公开(公告)号：US09398683B2

公开(公告)日：2016-07-19

申请号：US13850756

申请日：2013-03-26

Applicant: Apple Inc.

Inventor： David Fifield

IPC: H01G4/228 ,  H05K1/02 ,  H01G4/38 ,  H01G4/40 ,  H01G4/012 ,  H05K1/18

CPC classification number: H05K1/0239 ,  H01G4/012 ,  H01G4/228 ,  H01G4/385 ,  H01G4/40 ,  H05K1/0233 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611

Abstract: A packaged capacitor component such as a surface mount technology capacitor component may be formed with multiple self-resonant frequencies. The capacitor component may include multiple capacitor portions separated by dielectric layers. The capacitor portions may each be formed from interleaving conductive layers. Additional dielectric layers may be interposed between the interleaving conductive layers. Each capacitor portion may be characterized by a corresponding self-resonance frequency. If desired, a packaged capacitor component having multiple self-resonant frequencies may be formed by stacking multiple surface-mount capacitor components. Each of the stacked surface-mount capacitor components may include interleaving conductive layers that are centered between top and bottom surfaces of that component. Packaged capacitor components having multiple self-resonance frequencies may be used as direct-current blocking capacitors or decoupling capacitors.

Abstract translation: 可以形成具有多个自谐振频率的诸如表面贴装技术电容器部件的封装的电容器部件。 电容器组件可以包括由电介质层分离的多个电容器部分。 电容器部分可以分别由交织导电层形成。 另外的电介质层可插入交织导电层之间。 每个电容器部分的特征在于相应的自谐振频率。 如果需要，可以通过堆叠多个表面贴装电容器部件来形成具有多个自谐振频率的封装电容器部件。 层叠的表面安装电容器组件中的每一个可以包括在该部件的顶表面和底表面之间居中的交错导电层。 具有多个自谐振频率的封装电容器组件可以用作直流阻塞电容器或去耦电容器。

公开(公告)号：US20140292599A1

公开(公告)日：2014-10-02

申请号：US13850756

申请日：2013-03-26

Applicant: APPLE INC.

Inventor： David Fifield

IPC: H05K1/02 ,  H01G4/12 ,  H01G4/008 ,  H01G4/00

CPC classification number: H05K1/0239 ,  H01G4/012 ,  H01G4/228 ,  H01G4/385 ,  H01G4/40 ,  H05K1/0233 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611

Abstract: A packaged capacitor component such as a surface mount technology capacitor component may be formed with multiple self-resonant frequencies. The capacitor component may include multiple capacitor portions separated by dielectric layers. The capacitor portions may each be formed from interleaving conductive layers. Additional dielectric layers may be interposed between the interleaving conductive layers. Each capacitor portion may be characterized by a corresponding self-resonance frequency. If desired, a packaged capacitor component having multiple self-resonant frequencies may be formed by stacking multiple surface-mount capacitor components. Each of the stacked surface-mount capacitor components may include interleaving conductive layers that are centered between top and bottom surfaces of that component. Packaged capacitor components having multiple self-resonance frequencies may be used as direct-current blocking capacitors or decoupling capacitors.

Abstract translation: 可以形成具有多个自谐振频率的诸如表面贴装技术电容器部件的封装的电容器部件。 电容器组件可以包括由电介质层分离的多个电容器部分。 电容器部分可以分别由交织导电层形成。 另外的电介质层可插入交织导电层之间。 每个电容器部分的特征在于相应的自谐振频率。 如果需要，可以通过堆叠多个表面贴装电容器部件来形成具有多个自谐振频率的封装电容器部件。 层叠的表面安装电容器组件中的每一个可以包括在该部件的顶表面和底表面之间居中的交错导电层。 具有多个自谐振频率的封装电容器组件可以用作直流阻塞电容器或去耦电容器。