公开(公告)号：US12112890B2

公开(公告)日：2024-10-08

申请号：US17478047

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Borui Xia ,  Anthony Chih-Tung Chan ,  Shiyu Yue ,  Wei Lei ,  Aravind Miyar Kamath ,  Mukund Sundararajan ,  Rongjun Wang ,  Adolph Miller Allen

IPC: C23C14/35 ,  H01F7/18

CPC classification number: H01F7/18 ,  C23C14/358

Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.

公开(公告)号：US20230088552A1

公开(公告)日：2023-03-23

申请号：US17478047

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Borui Xia ,  Anthony Chih-Tung Chan ,  Shiyu Yue ,  Wei Lei ,  Aravind Miyar Kamath ,  Mukund Sundararajan ,  Rongjun Wang ,  Adolph Miller Allen

IPC: H01F7/18 ,  C23C14/35

Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.

公开(公告)号：USD1052548S1

公开(公告)日：2024-11-26

申请号：US29895796

申请日：2023-06-26

Applicant: Applied Materials, Inc.

Designer： Devi Raghavee Veerappan ,  Xiaoxiong Yuan ,  Peiyu Zhang ,  Borui Xia ,  Chih-Hsun Hsu

公开(公告)号：US20240153790A1

公开(公告)日：2024-05-09

申请号：US18387649

申请日：2023-11-07

Applicant: Applied Materials, Inc.

Inventor： Borui Xia ,  Chih-Hsun Hsu ,  Xiaoxiong Yuan ,  Le Zhang ,  David T. Or ,  Jiang Lu

IPC: H01L21/67 ,  H01L21/311

CPC classification number: H01L21/67069 ,  H01L21/31116

Abstract: Processing chambers including at least one gas reservoir connected to and in fluid communication with the lid through a fast-switching valve and a gas reservoir line are described. Processing methods, for example, etching methods, using the processing chambers are also described.