公开(公告)号：US12112890B2

公开(公告)日：2024-10-08

申请号：US17478047

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Borui Xia ,  Anthony Chih-Tung Chan ,  Shiyu Yue ,  Wei Lei ,  Aravind Miyar Kamath ,  Mukund Sundararajan ,  Rongjun Wang ,  Adolph Miller Allen

IPC: C23C14/35 ,  H01F7/18

CPC classification number: H01F7/18 ,  C23C14/358

Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.

公开(公告)号：US20230307211A1

公开(公告)日：2023-09-28

申请号：US17704840

申请日：2022-03-25

Applicant: Applied Materials, Inc.

Inventor： Aravind Miyar Kamath ,  Cheng-Hsiung Matthew Tsai ,  Manjunatha Koppa

IPC: H01J37/32 ,  H01J37/20

CPC classification number: H01J37/32009 ,  H01J37/20 ,  H01J2237/3321 ,  H01J2237/20

Abstract: Process kits for processing chambers and processing chambers having a lower shield and lower shield ring are described. The lower shield has a ring-shaped body with an inner wall and an outer wall, a top wall and a bottom wall with an outer ledge wall extends outwardly from a lower portion of the outer wall to an outer ledge outer wall. The lower shield ring has a ramped lower inner wall with a top face spaced a distance from the bottom face of the upper inner wall so that the distance decreases from the lower inner wall to an inside surface of the outer wall. At least one upper opening extends through the top portion of the lower shield ring and at least one opening extends through the lower portion of the lower shield ring. Upper shields configured to cooperatively interact with the lower shield and lower shield ring are also described.

公开(公告)号：US20230088552A1

公开(公告)日：2023-03-23

申请号：US17478047

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Borui Xia ,  Anthony Chih-Tung Chan ,  Shiyu Yue ,  Wei Lei ,  Aravind Miyar Kamath ,  Mukund Sundararajan ,  Rongjun Wang ,  Adolph Miller Allen

IPC: H01F7/18 ,  C23C14/35

Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.

公开(公告)号：US10892180B2

公开(公告)日：2021-01-12

申请号：US14450241

申请日：2014-08-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Bonnie T. Chia ,  Jallepally Ravi ,  Manjunatha Koppa ,  Vinod Konda Purathe ,  Cheng-Hsiung Matthew Tsai ,  Aravind Miyar Kamath

IPC: H01L21/687 ,  C23C16/46 ,  H01L21/683 ,  H01L21/67 ,  C30B25/12

Abstract: Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.

公开(公告)号：US10134615B2

公开(公告)日：2018-11-20

申请号：US15019573

申请日：2016-02-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Aravind Miyar Kamath ,  Cheng-Hsiung Tsai ,  Jallepally Ravi ,  Tomoharu Matsushita ,  Yu Chang

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket; wherein the conductive element includes features that engage the RF gasket to return the RF current to ground.