-
公开(公告)号：US11415538B2
公开(公告)日：2022-08-16
申请号：US16812071
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Leonard Tedeschi , Michael D. Willwerth , Daniel Thomas McCormick
Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.
-
公开(公告)号：US10923405B2
公开(公告)日：2021-02-16
申请号：US16116178
申请日：2018-08-29
Applicant: Applied Materials, Inc.
Inventor： Leonard Tedeschi , Kartik Ramaswamy , Daniel Thomas McCormick , Robert Paul Meagley
Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a particle monitoring device for particle detection includes several capacitive micro sensors mounted on a wafer substrate to detect particles under all pressure regimes, e.g., under vacuum conditions. In an embodiment, one or more capacitive micro sensors is mounted on a wafer processing tool to measure material deposition and removal rates in real-time during the wafer fabrication process. Other embodiments are also described and claimed.
-
公开(公告)号：US20210278360A1
公开(公告)日：2021-09-09
申请号：US16812071
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Leonard Tedeschi , Michael D. Willwerth , Daniel Thomas McCormick
IPC: G01N27/22
Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.
-
公开(公告)号：US20170365531A1
公开(公告)日：2017-12-21
申请号：US15187717
申请日：2016-06-20
Applicant: APPLIED MATERIALS, INC.
Inventor： Leonard Tedeschi , Kartik Ramaswamy , Daniel Thomas McCormick , Robert Paul Meagley
CPC classification number: H01L22/26 , G01D5/24 , G01D5/2405 , G01N15/1031 , G01N27/221 , G01N27/227 , G01N2015/0046 , G01N2015/1087 , H01L21/67253 , H01L22/12
Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a particle monitoring device for particle detection includes several capacitive micro sensors mounted on a wafer substrate to detect particles under all pressure regimes, e.g., under vacuum conditions. In an embodiment, one or more capacitive micro sensors is mounted on a wafer processing tool to measure material deposition and removal rates in real-time during the wafer fabrication process. Other embodiments are also described and claimed.
-
Patent Agency Ranking
公开(公告)号：US12163911B2
公开(公告)日：2024-12-10
申请号：US17861034
申请日：2022-07-08
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Leonard Tedeschi , Michael D. Willwerth , Daniel Thomas McCormick
IPC: G01N27/22
Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.
-
公开(公告)号：US11581206B2
公开(公告)日：2023-02-14
申请号：US16812066
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Leonard Tedeschi , Jennifer Sun , Philip Allan Kraus , Xiaopu Li , Kallol Bera , Michael D. Willwerth , Albert Barrett Hicks, III , Lisa J. Enman , Mark Joseph Saly , Daniel Thomas McCormick
IPC: H01L21/67 , G01N27/22 , G05B19/418
Abstract: Embodiments disclosed herein comprise a sensor. In an embodiment, the sensor comprises a substrate having a first surface and a second surface opposite from the first surface. In an embodiment, the sensor further comprises a first electrode over the first surface of the substrate, and a second electrode over the first surface of the substrate and adjacent to the first electrode. In an embodiment, the sensor further comprises a barrier layer over the first electrode and the second electrode.
-
公开(公告)号：US20210280443A1
公开(公告)日：2021-09-09
申请号：US16812066
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Leonard Tedeschi , Jennifer Sun , Philip Allan Kraus , Xiaopu Li , Kallol Bera , Michael D. Willwerth , Albert Barrett Hicks, III , Lisa J. Enman , Mark Joseph Saly , Daniel Thomas McCormick
IPC: H01L21/67 , G01N27/22 , G05B19/418
Abstract: Embodiments disclosed herein comprise a sensor. In an embodiment, the sensor comprises a substrate having a first surface and a second surface opposite from the first surface. In an embodiment, the sensor further comprises a first electrode over the first surface of the substrate, and a second electrode over the first surface of the substrate and adjacent to the first electrode. In an embodiment, the sensor further comprises a barrier layer over the first electrode and the second electrode.
-
公开(公告)号：US20180374764A1
公开(公告)日：2018-12-27
申请号：US16116178
申请日：2018-08-29
Applicant: Applied Materials, Inc.
Inventor： Leonard Tedeschi , Kartik Ramaswamy , Daniel Thomas McCormick , Robert Paul Meagley
Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a particle monitoring device for particle detection includes several capacitive micro sensors mounted on a wafer substrate to detect particles under all pressure regimes, e.g., under vacuum conditions. In an embodiment, one or more capacitive micro sensors is mounted on a wafer processing tool to measure material deposition and removal rates in real-time during the wafer fabrication process. Other embodiments are also described and claimed.
-
公开(公告)号：US10083883B2
公开(公告)日：2018-09-25
申请号：US15187717
申请日：2016-06-20
Applicant: APPLIED MATERIALS, INC.
Inventor： Leonard Tedeschi , Kartik Ramaswamy , Daniel Thomas McCormick , Robert Paul Meagley
CPC classification number: H01L22/26 , G01D5/24 , G01D5/2405 , G01N15/1031 , G01N27/221 , G01N27/227 , G01N2015/0046 , G01N2015/1087 , H01L21/67253 , H01L22/12 , H01L22/14
Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a particle monitoring device for particle detection includes several capacitive micro sensors mounted on a wafer substrate to detect particles under all pressure regimes, e.g., under vacuum conditions. In an embodiment, one or more capacitive micro sensors is mounted on a wafer processing tool to measure material deposition and removal rates in real-time during the wafer fabrication process. Other embodiments are also described and claimed.
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.019 seconds)
