公开(公告)号：US20230044262A1

公开(公告)日：2023-02-09

申请号：US17395351

申请日：2021-08-05

Applicant: Applied Materials, Inc.

Inventor： David John Peterson ,  Chuang-Chia Lin

IPC: H01J37/32

Abstract: Embodiments disclosed herein include sensor devices and methods of using the sensor devices. In an embodiment, a sensor device comprises a substrate, a support extending up from the substrate, and a resonator mechanically coupled to the support. In an embodiment, the sensor device further comprises an antenna that is configured to electromagnetically couple with the resonator, wherein the antenna is connected to a transmission line in the substrate.

公开(公告)号：US12062529B2

公开(公告)日：2024-08-13

申请号：US17395351

申请日：2021-08-05

Applicant: Applied Materials, Inc.

Inventor： David John Peterson ,  Chuang-Chia Lin

IPC: H01J37/32

CPC classification number: H01J37/32917 ,  H01J37/3222 ,  H01J37/32899 ,  H01J2237/24507 ,  H01J2237/24585

Abstract: Embodiments disclosed herein include sensor devices and methods of using the sensor devices. In an embodiment, a sensor device comprises a substrate, a support extending up from the substrate, and a resonator mechanically coupled to the support. In an embodiment, the sensor device further comprises an antenna that is configured to electromagnetically couple with the resonator, wherein the antenna is connected to a transmission line in the substrate.