公开(公告)号：US11251028B2

公开(公告)日：2022-02-15

申请号：US16405070

申请日：2019-05-07

Applicant: APPLIED MATERIALS, INC.

Inventor： Cheng-Hsiung Matt Tsai ,  Ananthkrishna Jupudi ,  Sarath Babu ,  Manjunatha P. Koppa ,  Hiroyuki Takahama

IPC: H01L21/67 ,  H01L21/68 ,  H01J37/34 ,  C23C14/02 ,  H01L21/687 ,  H01L21/677

Abstract: Substrate processing chambers with integrated shutter garage are provided herein. In some embodiments, a pre-clean substrate processing chamber may include a chamber body, wherein the chamber body includes a first side configured to be attached to mainframe substrate processing tool, and a second side disposed opposite the first side, a substrate support configured to support a substrate when disposed thereon, a shutter disk garage disposed on the second side of the process chamber, and a shutter disk assembly mechanism comprising a rotatable shaft, and a robot shutter arm coupled to the shaft, wherein the robot shutter arm includes a shutter disk assembly support section configured to support a shutter disk assembly, and wherein the shutter disk assembly mechanism is configured to move the robot shutter arm between a storage position within the shutter garage and a processing position within the process chamber over the substrate support.

公开(公告)号：US20250029816A1

公开(公告)日：2025-01-23

申请号：US18773859

申请日：2024-07-16

Applicant: Applied Materials, Inc.

Inventor： Douglas Long ,  Vinod Kumar Konda Purathe ,  Dien-Yeh Wu ,  Jallepally Ravi ,  Hideaki Goto ,  Manjunatha Koppa ,  Hiroyuki Takahama ,  Shih Yao Hsu ,  Sandesh Yadamane Dharmaiah

IPC: H01J37/32 ,  C23C16/455

Abstract: Gas distribution assemblies for a semiconductor manufacturing processing chamber comprising a first showerhead with a first flange and a second showerhead with a second flange. A first two-piece RF isolator comprises a first inner RF isolator spaced from a first outer RF isolator. The first inner RF isolator spaced from the first flange of the first showerhead to create a first flow path. A second two-piece RF isolator comprises a second inner RF isolator spaced from a second outer RF isolator. The second RF isolator spaced from the second flange of the second showerhead to create a second flow path. Processing chambers incorporating the gas distribution assemblies, and processing methods using the gas distribution assemblies are also described.

公开(公告)号：USD904640S1

公开(公告)日：2020-12-08

申请号：US29677482

申请日：2019-01-21

Applicant: APPLIED MATERIALS, INC.

Designer： Fred Eric Ruhland ,  Sumit S. Patankar ,  Vijay D. Parkhe ,  Daniel Lee Diehl ,  Mingwei Zhu ,  Hiroyuki Takahama ,  Randy D. Schmieding

公开(公告)号：US12228395B2

公开(公告)日：2025-02-18

申请号：US17530538

申请日：2021-11-19

Applicant: Applied Materials, Inc.

Inventor： Tomoharu Matsushita ,  Aravind Kamath ,  Jallepally Ravi ,  Cheng-Hsiung Tsai ,  Hiroyuki Takahama

IPC: G01B5/004 ,  H01L21/68 ,  H01L21/683 ,  B25J11/00

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.

公开(公告)号：US12125728B2

公开(公告)日：2024-10-22

申请号：US16746285

申请日：2020-01-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Fred Eric Ruhland ,  Sumit S. Patankar ,  Vijay D. Parkhe ,  Daniel Lee Diehl ,  Mingwei Zhu ,  Hiroyuki Takahama ,  Randy D. Schmieding

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67754

Abstract: Embodiments of a substrate carrier are provided herein. In some embodiments, a substrate carrier includes a base plate, wherein the base plate is a thin, solid plate with no through holes or embedded components; and a plurality of raised portions extending from the base plate, wherein the plurality of raised portions include first raised portions and second raised portions, the first raised portions disposed radially inward from the second raised portions, wherein the base plate and the plurality of raised portions define pockets configured to retain a plurality of substrates, and wherein an upper surface of the second raised portions have a greater surface area than an upper surface of the first raised portions.

公开(公告)号：US11201078B2

公开(公告)日：2021-12-14

申请号：US15468509

申请日：2017-03-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Tomoharu Matsushita ,  Aravind Kamath ,  Jallepally Ravi ,  Cheng-Hsiung Tsai ,  Hiroyuki Takahama

IPC: H01L21/683 ,  G01L21/02 ,  H01L21/67

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.