-
公开(公告)号:US20200235006A1
公开(公告)日:2020-07-23
申请号:US16564489
申请日:2019-09-09
Applicant: Applied Materials, Inc.
Inventor: Zhiyuan WU , Nikolaos BEKIARIS , Mehul B. NAIK , Jin Hee PARK , Mark Hyun LEE
IPC: H01L21/768 , H01L21/67 , H01L21/285 , H01L21/288 , H01L23/528 , H01L23/532
Abstract: In one implementation, a method of forming a cobalt layer on a substrate is provided. The method comprises forming a barrier and/or liner layer on a substrate having a feature definition formed in a first surface of the substrate, wherein the barrier and/or liner layer is formed on a sidewall and bottom surface of the feature definition. The method further comprises exposing the substrate to a ruthenium precursor to form a ruthenium-containing layer on the barrier and/or liner layer. The method further comprises exposing the substrate to a cobalt precursor to form a cobalt seed layer atop the ruthenium-containing layer. The method further comprises forming a bulk cobalt layer on the cobalt seed layer to fill the feature definition.
-
公开(公告)号:US20180211872A1
公开(公告)日:2018-07-26
申请号:US15874041
申请日:2018-01-18
Applicant: Applied Materials, Inc.
Inventor: Zhiyuan WU , Nikolaos BEKIARIS , Mehul B. NAIK , Jin Hee PARK , Mark Hyun LEE
IPC: H01L21/768 , H01L23/532 , H01L23/528 , H01L21/288 , H01L21/285
CPC classification number: H01L21/76846 , H01L21/28556 , H01L21/28568 , H01L21/2885 , H01L21/67167 , H01L21/67184 , H01L21/67207 , H01L21/76856 , H01L21/76862 , H01L21/76864 , H01L21/76873 , H01L21/76876 , H01L21/76882 , H01L23/528 , H01L23/53209 , H01L23/53252
Abstract: In one implementation, a method of forming a cobalt layer on a substrate is provided. The method comprises forming a barrier and/or liner layer on a substrate having a feature definition formed in a first surface of the substrate, wherein the barrier and/or liner layer is formed on a sidewall and bottom surface of the feature definition. The method further comprises exposing the substrate to a ruthenium precursor to form a ruthenium-containing layer on the barrier and/or liner layer. The method further comprises exposing the substrate to a cobalt precursor to form a cobalt seed layer atop the ruthenium-containing layer. The method further comprises forming a bulk cobalt layer on the cobalt seed layer to fill the feature definition.
-