公开(公告)号：US20230367288A1

公开(公告)日：2023-11-16

申请号：US17745730

申请日：2022-05-16

Applicant: Applied Materials, Inc.

Inventor： Jeong Jin Hong ,  Mi Hyun Jang ,  Sidharth Bhatia ,  Sejune Cheon ,  Joshua Maher ,  Upendra Ummethala

IPC: G05B19/4099

CPC classification number: G05B19/4099 ,  G05B2219/45031

Abstract: Embodiments disclosed herein include a method for use with a semiconductor processing tool. In an embodiment, the method comprises configuring the semiconductor processing tool, running a benchmark test on the semiconductor processing tool, providing hardware operating window (HOW) analytics, generating a design of experiment (DoE) using the HOW analytics, implementing process optimization, and releasing an iteration of the process recipe. In an embodiment, the method further comprises margin testing the iteration of the process recipe.