公开(公告)号：US20190048470A1

公开(公告)日：2019-02-14

申请号：US16164392

申请日：2018-10-18

Applicant: Applied Materials, Inc.

Inventor： Adib KHAN ,  Shankar VENKATARAMAN ,  Jay D. PINSON, II ,  Jang-Gyoo YANG ,  Nitin Krishnarao INGLE ,  Qiwei LIANG

IPC: C23C16/56 ,  H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  C23C16/44 ,  H01L21/02 ,  C23C16/46 ,  C23C16/455

Abstract: Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.

公开(公告)号：US20150329970A1

公开(公告)日：2015-11-19

申请号：US14577828

申请日：2014-12-19

Applicant: Applied Materials, Inc.

Inventor： Adib KHAN ,  Shankar VENKATARAMAN ,  Jay D. PINSON, II ,  Jang-Gyoo YANG ,  Nitin Krishnarao INGLE ,  Qiwei LIANG

IPC: C23C16/56 ,  H01L21/677 ,  C23C16/46 ,  H01L21/02 ,  C23C16/44 ,  C23C16/455

CPC classification number: C23C16/56 ,  C23C16/44 ,  C23C16/45565 ,  C23C16/46 ,  H01L21/02282 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67778 ,  H01L21/68742 ,  H01L21/68785

Abstract: Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.

Abstract translation: 本公开的实施例一般涉及一次批处理室，其适于一次同时固化多个基板。 批处理室包括各自独立温度控制的多个处理子区域。 批处理室可以包括第一和第二子处理区域，每个子处理区域由批处理室外部的基板输送装置维护。 此外，安装在分批固化室的装载开口上的开槽盖减少了在装载和卸载期间进入室的环境空气的影响。

公开(公告)号：US20150325411A1

公开(公告)日：2015-11-12

申请号：US14703922

申请日：2015-05-05

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Huixiong DAI ,  Srinivas D. NEMANI ,  Ellie Y. YIEH ,  Nitin Krishnarao INGLE

IPC: H01J37/32

Abstract: Embodiments of the disclosure include apparatus and methods for modifying a surface of a substrate using a surface modification process. The process of modifying a surface of a substrate generally includes the alteration of a physical or chemical property and/or redistribution of a portion of an exposed material on the surface of the substrate by use of one or more energetic particle beams while the substrate is disposed within a particle beam modification apparatus. Embodiments of the disclosure also provide a surface modification process that includes one or more pre-modification processing steps and/or one or more post-modification processing steps that are all performed within one processing system.

Abstract translation: 本公开的实施方案包括使用表面改性方法修饰基材的表面的装置和方法。 修饰基材的表面的方法通常包括通过使用一种或多种能量粒子束来改变基材表面上暴露的材料的一部分的物理或化学性质和/或再分布，同时衬底被布置 在粒子束修改装置内。 本公开的实施例还提供了表面修改过程，其包括一个或多个预修改处理步骤和/或一个或多个修改后处理步骤，其全部在一个处理系统内执行。