公开(公告)号：US20220245307A1

公开(公告)日：2022-08-04

申请号：US17166965

申请日：2021-02-03

Applicant: Applied Materials, Inc.

Inventor： Prashanth Kothnur ,  Karthik Ramanathan ,  Ajit Balakrishna ,  Kartik Shah ,  Umesh Kelkar ,  Vishwas Pandey ,  Prasoon Shukla ,  Sushil Arun Samant

IPC: G06F30/27 ,  G05B13/02 ,  G05B17/02 ,  H01L21/67 ,  H03H17/02

Abstract: Embodiments described herein include processes for generating a hybrid model for modeling processes in semiconductor processing equipment. In a particular embodiment, method of creating a hybrid machine learning model comprises identifying a first set of cases spanning a first range of process and/or hardware parameters, and running experiments in a lab for the first set of cases. The method may further comprise compiling experimental outputs from the experiments, and running physics based simulations for the first set of cases. In an embodiment, the method may further comprise compiling model outputs from the simulations, and correlating the model outputs with the experimental outputs with a machine learning algorithm to provide the hybrid machine learning model.