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公开(公告)号:US20220245307A1
公开(公告)日:2022-08-04
申请号:US17166965
申请日:2021-02-03
Applicant: Applied Materials, Inc.
Inventor: Prashanth Kothnur , Karthik Ramanathan , Ajit Balakrishna , Kartik Shah , Umesh Kelkar , Vishwas Pandey , Prasoon Shukla , Sushil Arun Samant
Abstract: Embodiments described herein include processes for generating a hybrid model for modeling processes in semiconductor processing equipment. In a particular embodiment, method of creating a hybrid machine learning model comprises identifying a first set of cases spanning a first range of process and/or hardware parameters, and running experiments in a lab for the first set of cases. The method may further comprise compiling experimental outputs from the experiments, and running physics based simulations for the first set of cases. In an embodiment, the method may further comprise compiling model outputs from the simulations, and correlating the model outputs with the experimental outputs with a machine learning algorithm to provide the hybrid machine learning model.
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公开(公告)号:US20250086342A1
公开(公告)日:2025-03-13
申请号:US18826639
申请日:2024-09-06
Applicant: Applied Materials, Inc.
Inventor: Ala Moradian , Umesh Kelkar , Prashanth Kothnur , Karthik Ramanathan , Preetham Rao , Mudit Pasagadagula , Anup Kumar D. Doddamane
IPC: G06F30/17
Abstract: A method includes receiving, via a graphical user interface (GUI), by a processing device, a first user input to view data associated with a first process chamber in a first chamber data mode. Data of the first chamber data mode includes data of a process operation performed in the first process chamber. The method further includes providing, for display on the GUI, first display data of the first data chamber mode responsive to receiving the first user input. The method further includes receiving a second user input to view data associated with the first process chamber in a second chamber data mode. Data of the second chamber data mode includes data of a virtual process operation performed by a virtual representation of the first process chamber. The method further includes providing, for display on the GUI, second display data of the second data chamber mode.
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公开(公告)号:US20240230189A1
公开(公告)日:2024-07-11
申请号:US18093615
申请日:2023-01-05
Applicant: APPLIED MATERIALS, INC.
Inventor: Ala Moradian , Umesh Kelkar , Orlando Trejo , Elizabeth Kathryn Neville , Karthik Ramanathan
CPC classification number: F25B49/00 , F25B41/40 , F25B2500/19 , F25B2700/2105
Abstract: Technologies directed to cooling flow according to predicted cooling parameters for substrate processing are described. In some embodiments, a method includes receiving first data indicative of a process recipe for processing a substrate in a processing chamber of a substrate processing system. The method further includes inputting the first data into a model. The model includes a digital twin configured to represent thermal characteristics of the processing chamber. The method further includes receiving, via the model, a predicted value of a parameter associated with a flow of coolant through a cooling loop of the processing chamber. The method further includes causing coolant to flow through the cooling loop based on the predicted value of the parameter during execution of the process recipe in the processing chamber.
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