公开(公告)号：US20230420279A1

公开(公告)日：2023-12-28

申请号：US18244557

申请日：2023-09-11

Applicant: Applied Materials, Inc.

Inventor： Masato ISHII ,  Richard O. COLLINS ,  Richard GILJUM ,  Alexander BERGER

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/673 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/67778 ,  H01L21/67751 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/67346 ,  H01L21/67748 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/68757 ,  H01L21/68735 ,  H01L21/67126 ,  H01L21/67115 ,  H01L21/67109 ,  H01L21/67017 ,  H01L21/67248 ,  H01L21/68 ,  H01L21/67207 ,  H01L21/67739

Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

公开(公告)号：US20220351999A1

公开(公告)日：2022-11-03

申请号：US17866152

申请日：2022-07-15

Applicant: Applied Materials, Inc.

Inventor： Masato ISHII ,  Richard O. COLLINS ,  Richard GILJUM ,  Alexander BERGER

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/673 ,  H01L21/67 ,  H01L21/68

Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

公开(公告)号：US20190252229A1

公开(公告)日：2019-08-15

申请号：US15894735

申请日：2018-02-12

Applicant: Applied Materials, Inc.

Inventor： Masato ISHII ,  Richard O. COLLINS ,  Richard GILJUM ,  Alexander BERGER

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67 ,  H01L21/673

Abstract: A substrate processing system is disclosed which includes a substrate input/output chamber coupled to a transfer chamber, and one or more processing chambers coupled to the transfer chamber, wherein the substrate input/output chamber includes a plurality of stacked carrier holders, and one of the carrier holders includes a substrate carrier to support a substrate thereon.