公开(公告)号：US11621182B2

公开(公告)日：2023-04-04

申请号：US17080595

申请日：2020-10-26

Applicant: Applied Materials, Inc.

Inventor： Devendra Channappa Holeyannavar ,  Sandesh Doddamane Ramappa ,  Dean C. Hruzek ,  Michael R. Rice ,  Jeffrey A. Brodine

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: An equipment front end module (EFEM) includes sidewalls forming an EFEM chamber configured to receive inert gas from an inert gas supply. The sidewalls include a first sidewall configured to attach to a panel first side of a panel. The panel forms a panel opening extending between the panel first side and a panel second side. The panel second side is configured to attach to a side storage pod. The EFEM further includes a robot disposed in the EFEM chamber. The robot is configured to transfer substrates from the EFEM chamber into the side storage pod via the panel opening. An exhaust conduit is coupled to the side storage pod to exhaust gas from the side storage pod to an exterior of the side storage pod.

公开(公告)号：US20210043479A1

公开(公告)日：2021-02-11

申请号：US17080595

申请日：2020-10-26

Applicant: Applied Materials, Inc.

Inventor： Devendra Channappa Holeyannavar ,  Sandesh Doddamane Ramappa ,  Dean C. Hruzek ,  Michael R. Rice ,  Jeffrey A. Brodine

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: An equipment front end module (EFEM) includes sidewalls forming an EFEM chamber configured to receive inert gas from an inert gas supply. The sidewalls include a first sidewall configured to attach to a panel first side of a panel. The panel forms a panel opening extending between the panel first side and a panel second side. The panel second side is configured to attach to a side storage pod. The EFEM further includes a robot disposed in the EFEM chamber. The robot is configured to transfer substrates from the EFEM chamber into the side storage pod via the panel opening. An exhaust conduit is coupled to the side storage pod to exhaust gas from the side storage pod to an exterior of the side storage pod.

公开(公告)号：US20180374725A1

公开(公告)日：2018-12-27

申请号：US15632074

申请日：2017-06-23

Applicant: Applied Materials, Inc.

Inventor： Devendra Channappa Holeyannavar ,  Sandesh Doddamane Ramappa ,  Dean C. Hruzek ,  Michael R. Rice ,  Jeffrey A. Brodine

IPC: H01L21/67

CPC classification number: H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/67769 ,  H01L21/67775

Abstract: Electronic device processing systems including side storage pods are described. One electronic device processing system has a side storage pod having a first chamber configured to receive a side storage container; a panel having a panel opening; the panel configured to be coupled between a side storage container and an equipment front end module; a side storage container received in the first chamber; and an exhaust conduit configured to be coupled to the side storage container received and extending to an exterior of the first chamber.

公开(公告)号：US12142500B2

公开(公告)日：2024-11-12

申请号：US18116759

申请日：2023-03-02

Applicant: Applied Materials, Inc.

Inventor： Devendra Channappa Holeyannavar ,  Sandesh Doddamane Ramappa ,  Dean C. Hruzek ,  Michael R. Rice ,  Jeffrey A. Brodine

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: A platform is of a side storage pod. The platform includes an upper surface and kinematic pins extending from the upper surface within a chamber of the side storage pod to engage a lower surface of a side storage container in the chamber to level the side storage container in the chamber.

公开(公告)号：US20230207354A1

公开(公告)日：2023-06-29

申请号：US18116759

申请日：2023-03-02

Applicant: Applied Materials, Inc.

Inventor： Devendra Channappa Holeyannavar ,  Sandesh Doddamane Ramappa ,  Dean C. Hruzek ,  Michael R. Rice ,  Jeffrey A. Brodine

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67178 ,  H01L21/6719 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67207

Abstract: A platform is of a side storage pod. The platform includes an upper surface and kinematic pins extending from the upper surface within a chamber of the side storage pod to engage a lower surface of a side storage container in the chamber to level the side storage container in the chamber.

公开(公告)号：US20190267266A1

公开(公告)日：2019-08-29

申请号：US16411009

申请日：2019-05-13

Applicant: Applied Materials, Inc.

Inventor： Devendra Channappa Holeyannavar ,  Sandesh Doddamane Ramappa ,  Dean C. Hruzek ,  Michael R. Rice ,  Jeffrey A. Brodine

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: Electronic device processing systems including side storage pods are described. One electronic device processing system has a side storage pod having a first chamber configured to receive a side storage container; a panel having a panel opening; the panel configured to be coupled between a side storage container and an equipment front end module; a side storage container received in the first chamber; and an exhaust conduit configured to be coupled to the side storage container received and extending to an exterior of the first chamber.

公开(公告)号：US10388547B2

公开(公告)日：2019-08-20

申请号：US15632074

申请日：2017-06-23

Applicant: Applied Materials, Inc.

Inventor： Devendra Channappa Holeyannavar ,  Sandesh Doddamane Ramappa ,  Dean C. Hruzek ,  Michael R. Rice ,  Jeffrey A. Brodine

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: Electronic device processing systems including side storage pods are described. One electronic device processing system has a side storage pod having a first chamber configured to receive a side storage container; a panel having a panel opening; the panel configured to be coupled between a side storage container and an equipment front end module; a side storage container received in the first chamber; and an exhaust conduit configured to be coupled to the side storage container received and extending to an exterior of the first chamber.