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公开(公告)号：US12159802B2
公开(公告)日：2024-12-03
申请号：US17683938
申请日：2022-03-01
Applicant: APPLIED MATERIALS, INC.
Inventor： Srinivas Poshatrahalli Gopalakrishna , Paul B. Reuter , Devendra Channappa Holeyannavar , Douglas B. Baumgarten , Sushant S. Koshti , Arunkumar Ramachandraiah , Narayanan Ramachandran
IPC: H01L21/677 , B25J9/16
Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening through which one or more substrates are capable of being transported between the substrate carrier and the factory interface. The load port can also include an actuator coupled to the frame, and a load port door coupled to the actuator and configured to seal the transport opening. The frame height can be greater than the height of the load port door, and less than 2.5 times the height of the load port door.
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公开(公告)号：US20220086364A1
公开(公告)日：2022-03-17
申请号：US17021992
申请日：2020-09-15
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号：US12142500B2
公开(公告)日：2024-11-12
申请号：US18116759
申请日：2023-03-02
Applicant: Applied Materials, Inc.
Inventor： Devendra Channappa Holeyannavar , Sandesh Doddamane Ramappa , Dean C. Hruzek , Michael R. Rice , Jeffrey A. Brodine
IPC: H01L21/67 , H01L21/673 , H01L21/677
Abstract: A platform is of a side storage pod. The platform includes an upper surface and kinematic pins extending from the upper surface within a chamber of the side storage pod to engage a lower surface of a side storage container in the chamber to level the side storage container in the chamber.
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公开(公告)号：US12114083B2
公开(公告)日：2024-10-08
申请号：US18214417
申请日：2023-06-26
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
CPC classification number: H04N23/90 , H01L21/67276 , H04N23/56 , H04N23/555
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号：US20230207354A1
公开(公告)日：2023-06-29
申请号：US18116759
申请日：2023-03-02
Applicant: Applied Materials, Inc.
Inventor： Devendra Channappa Holeyannavar , Sandesh Doddamane Ramappa , Dean C. Hruzek , Michael R. Rice , Jeffrey A. Brodine
IPC: H01L21/67 , H01L21/673 , H01L21/677
CPC classification number: H01L21/67178 , H01L21/6719 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67379 , H01L21/67389 , H01L21/67769 , H01L21/67775 , H01L21/67207
Abstract: A platform is of a side storage pod. The platform includes an upper surface and kinematic pins extending from the upper surface within a chamber of the side storage pod to engage a lower surface of a side storage container in the chamber to level the side storage container in the chamber.
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Patent Agency Ranking
公开(公告)号：US20220285193A1
公开(公告)日：2022-09-08
申请号：US17683938
申请日：2022-03-01
Applicant: APPLIED MATERIALS, INC.
Inventor： Srinivas Poshatrahalli Gopalakrishna , Paul B. Reuter , Devendra Channappa Holeyannavar , Douglas B. Baumgarten , Sushant S. Koshti , Arunkumar Ramachandraiah , Narayanan Ramachandran
IPC: H01L21/677 , B25J9/16
Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening through which one or more substrates are capable of being transported between the substrate carrier and the factory interface. The load port can also include an actuator coupled to the frame, and a load port door coupled to the actuator and configured to seal the transport opening. The frame height can be greater than the height of the load port door, and less than 2.5 times the height of the load port door.
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公开(公告)号：US20190267266A1
公开(公告)日：2019-08-29
申请号：US16411009
申请日：2019-05-13
Applicant: Applied Materials, Inc.
Inventor： Devendra Channappa Holeyannavar , Sandesh Doddamane Ramappa , Dean C. Hruzek , Michael R. Rice , Jeffrey A. Brodine
IPC: H01L21/67 , H01L21/673 , H01L21/677
Abstract: Electronic device processing systems including side storage pods are described. One electronic device processing system has a side storage pod having a first chamber configured to receive a side storage container; a panel having a panel opening; the panel configured to be coupled between a side storage container and an equipment front end module; a side storage container received in the first chamber; and an exhaust conduit configured to be coupled to the side storage container received and extending to an exterior of the first chamber.
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公开(公告)号：US10388547B2
公开(公告)日：2019-08-20
申请号：US15632074
申请日：2017-06-23
Applicant: Applied Materials, Inc.
Inventor： Devendra Channappa Holeyannavar , Sandesh Doddamane Ramappa , Dean C. Hruzek , Michael R. Rice , Jeffrey A. Brodine
IPC: H01L21/67 , H01L21/673 , H01L21/677
Abstract: Electronic device processing systems including side storage pods are described. One electronic device processing system has a side storage pod having a first chamber configured to receive a side storage container; a panel having a panel opening; the panel configured to be coupled between a side storage container and an equipment front end module; a side storage container received in the first chamber; and an exhaust conduit configured to be coupled to the side storage container received and extending to an exterior of the first chamber.
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公开(公告)号：US12142508B2
公开(公告)日：2024-11-12
申请号：US17499109
申请日：2021-10-12
Applicant: APPLIED MATERIALS, INC.
Inventor： Sushant S. Koshti , Paul B. Reuter , David Phillips , Jacob Newman , Andrew J. Constant , Michael R. Rice , Shay Assaf , Srinivas Poshatrahalli Gopalakrishna , Devendra Channappa Holeyannavar , Douglas B. Baumgarten , Arunkumar Ramachandraiah , Narayanan Ramachandran
IPC: H01L21/677 , B65G1/04 , H01L21/687
Abstract: A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.
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公开(公告)号：US20230345137A1
公开(公告)日：2023-10-26
申请号：US18214417
申请日：2023-06-26
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
CPC classification number: H04N23/90 , H01L21/67276 , H04N23/56 , H04N23/555
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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