公开(公告)号：US20240337449A1

公开(公告)日：2024-10-10

申请号：US18206861

申请日：2023-06-07

Applicant: Applied Materials, Inc.

Inventor： Santosh S. Nesarkar ,  Harinath Reghunathannair ,  Sathishkumar Kummamoorthy

IPC: F28D17/04 ,  F28D17/02 ,  H01J37/32 ,  H01L21/67

CPC classification number: F28D17/04 ,  F28D17/02 ,  H01J37/32522 ,  H01J37/32834 ,  H01L21/67069 ,  H01J2237/3341

Abstract: Semiconductor processing systems and system components are described for providing regenerative heating to a foreline component. A system includes a plasma-based processing chamber. The processing chamber includes one or more fluid paths configured to circulate a heat transfer fluid. The system also includes one or more vacuum systems configured to exhaust process gases from the processing chamber, the one or more vacuum systems including one or more vacuum pumps and a foreline vent. The system includes a foreline regenerator. The foreline regenerator includes a regenerator shell at least partially surrounding the foreline vent, the regenerator shell including a heat transfer fluid input and a heat transfer fluid output, wherein the heat transfer fluid input is coupled to an output of the processing chamber.