公开(公告)号：US20250137119A1

公开(公告)日：2025-05-01

申请号：US18495330

申请日：2023-10-26

Applicant: Applied Materials, Inc.

Inventor： Bhargav S. CITLA ,  Shreyas SHUKLA ,  Srinivas D. NEMANI ,  Ellie Y. YIEH

IPC: C23C16/26 ,  C23C16/04 ,  H01L21/02 ,  H01L21/311

Abstract: The present disclosure provides methods and apparatus that facilitate the formation of high-quality carbon gapfill structures and that address the issues related to conventional carbon gapfill methods. In certain embodiments, the carbon gapfill methods and apparatus described herein include plasma enhanced CVD (PECVD) or flowable CVD (FCVD) processes to gapfill structures with high-quality, and stable carbon films.