公开(公告)号：US20240275490A1

公开(公告)日：2024-08-15

申请号：US18437607

申请日：2024-02-09

Applicant: Applied Optoelectronics, Inc.

Inventor： Rafael CELEDON ,  Yi WANG ,  Tina MATHEWS ,  Ruru CHEN ,  Mark SIEJKA ,  Hang XIE ,  Ramesh NALLUR

IPC: H04B10/2575 ,  H04B10/25

CPC classification number: H04B10/25751 ,  H04B10/2589

Abstract: Low data rate, low power, bi-directional transmissions may be provided over existing physical communication media (e.g., coaxial cables and/or optical fiber) and in the presence of higher bandwidth, higher power primary signals currently being transmitted over the communication media. The low data rate, low power, bi-directional transmissions may be accomplished using spread-spectrum modulated signals that are positioned in frequency relative to the primary signals, such that the low data rate, low power transmissions occur without detectable interference with the primary signals, which include multiplexed narrowband modulated signals. In some embodiments, the primary signals may be modulated using quadrature amplitude modulation (QAM) and multiplexed using orthogonal frequency division multiplexing (OFDM) and the spread-spectrum modulated signals may be chirp spread spectrum (CSS) modulated signals modulated using Gaussian frequency shift keying (GFSK). One example of the spread-spectrum modulated signals is implemented using LoRa technology and communication protocols defined by the LoRaWAN standard.

公开(公告)号：US20250125987A1

公开(公告)日：2025-04-17

申请号：US18887438

申请日：2024-09-17

Applicant: Applied Optoelectronics, Inc.

Inventor： Bao KIEN ,  Mark SIEJKA ,  Rafael CELEDON ,  Ramesh NALLUR

IPC: H04L12/28

Abstract: The present disclosure provides a computer-implemented method for communication with radio frequency (RF) amplifiers in a hybrid fiber-coaxial (HFC) network, the computer-implemented method including: providing, by one or more computer processors, return communications from one or more RF amplifiers to a headend; and providing, by the one or more computer processors, forward communications from the headend to the one or more RF amplifiers, wherein: the return communications and the forward communications use out of band (OOB) communication protocols.

公开(公告)号：US20250047518A1

公开(公告)日：2025-02-06

申请号：US18792054

申请日：2024-08-01

Applicant: Applied Optoelectronics, Inc.

Inventor： Rafael CELEDON ,  Yi WANG ,  Tina MATHEWS ,  Ruru CHEN ,  Mark SIEJKA ,  Hang XIE ,  Ramesh NALLUR ,  Stefan MURRY ,  David STEWART

IPC: H04L12/28 ,  H04B1/69

Abstract: Low data rate, low power, bi-directional transmissions may be provided over existing physical communication media (e.g., coaxial cables) using a portable network communications module and in the presence of higher bandwidth, higher power primary signals currently being transmitted over the communication media. The low data rate, low power, bi-directional transmissions may be accomplished using spread-spectrum modulated signals that are positioned in frequency relative to the primary signals, such that the low data rate, low power transmissions occur without detectable interference with the primary signals, which include multiplexed narrowband modulated signals. The primary signals may be modulated using quadrature amplitude modulation (QAM) and multiplexed using orthogonal frequency division multiplexing (OFDM) and the spread-spectrum modulated signals may be chirp spread spectrum (CSS) modulated signals modulated using Gaussian frequency shift keying (GFSK). One example of the spread-spectrum modulated signals is implemented using LoRa technology and communication protocols defined by the LoRaWAN standard.

公开(公告)号：US20180092199A1

公开(公告)日：2018-03-29

申请号：US15275785

申请日：2016-09-26

Applicant: Applied Optoelectronics, Inc.

Inventor： Rafael CELEDON ,  Mark SIEJKA ,  Michael JONES

IPC: H05K1/02 ,  H05K1/18 ,  G02B6/42

CPC classification number: H05K1/0204 ,  G02B6/4272 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/18 ,  H05K3/0061 ,  H05K2201/10121 ,  H05K2201/10416

Abstract: A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.

公开(公告)号：US20240275426A1

公开(公告)日：2024-08-15

申请号：US18437594

申请日：2024-02-09

Applicant: Applied Optoelectronics, Inc.

Inventor： Rafael CELEDON ,  Yi WANG ,  Tina MATHEWS ,  Ruru CHEN ,  Mark SIEJKA ,  Hang XIE ,  Ramesh NALLUR

IPC: H04B1/69 ,  H04L12/28

CPC classification number: H04B1/69 ,  H04L12/2801 ,  H04B2001/6912

Abstract: Low data rate, low power, bi-directional transmissions may be provided over existing physical communication media (e.g., coaxial cables and/or optical fiber) and in the presence of higher bandwidth, higher power primary signals currently being transmitted over the communication media. The low data rate, low power, bi-directional transmissions may be accomplished using spread-spectrum modulated signals that are positioned in frequency relative to the primary signals, such that the low data rate, low power transmissions occur without detectable interference with the primary signals, which include multiplexed narrowband modulated signals. In some embodiments, the primary signals may be modulated using quadrature amplitude modulation (QAM) and multiplexed using orthogonal frequency division multiplexing (OFDM) and the spread-spectrum modulated signals may be chirp spread spectrum (CSS) modulated signals modulated using Gaussian frequency shift keying (GFSK). One example of the spread-spectrum modulated signals is implemented using LoRa technology and communication protocols defined by the LoRaWAN standard.

公开(公告)号：US20230118298A1

公开(公告)日：2023-04-20

申请号：US17962129

申请日：2022-10-07

Applicant: Applied Optoelectronics, Inc.

Inventor： George GONCALVES ,  Rafael CELEDON ,  Mark SIEJKA

IPC: H04N21/438 ,  H04N21/414 ,  H04N21/236

Abstract: A broadband digital access (BDA) architecture includes a BDA hub device in a headend/hub and one or more BDA node modules in one or more HFC nodes to enable digital communications between the headend/hub and the HFC node(s) in a CATV/HFC network. The BDA hub device and the BDA node module(s) are connected by one or more downstream optical fibers and one or more upstream optical fibers to enable digital optical communications therebetween. The BDA hub device provides an analog RF interface with equipment in the headend/hub and the BDA node module provides an analog RF interface with subscriber locations via one or more coaxial cables.