公开(公告)号：US20230268312A1

公开(公告)日：2023-08-24

申请号：US17675600

申请日：2022-02-18

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Peter M. Wallace ,  Daniel E. Mendoza

IPC: H01L23/00 ,  B23K1/00 ,  B23K3/08

CPC classification number: H01L24/75 ,  B23K1/0012 ,  B23K1/0016 ,  B23K3/087 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/7532 ,  H01L2224/75312 ,  H01L2224/75318 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83203 ,  H01L2224/83815

Abstract: A pressure collet that operably engages with a die in which the pressure collet is configured to land on predetermined positions of the die without damaging said die, a perform, or a heat spreader during a reflow process. The pressure collet further comprises a plate that has a mounting surface and a plurality of contact pads that operably engages with the mounting surface of the plate. The plurality of contact pads is configured to apply pressure to predetermined positions of a die without the mounting surface of the plate contacting the die during a reflow process. The plate of the pressure collet is also formed of a first material and the plurality of contact pads are formed of a second material different than the first material.