公开(公告)号：US20230268312A1

公开(公告)日：2023-08-24

申请号：US17675600

申请日：2022-02-18

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Peter M. Wallace ,  Daniel E. Mendoza

IPC: H01L23/00 ,  B23K1/00 ,  B23K3/08

CPC classification number: H01L24/75 ,  B23K1/0012 ,  B23K1/0016 ,  B23K3/087 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/7532 ,  H01L2224/75312 ,  H01L2224/75318 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83203 ,  H01L2224/83815

Abstract: A pressure collet that operably engages with a die in which the pressure collet is configured to land on predetermined positions of the die without damaging said die, a perform, or a heat spreader during a reflow process. The pressure collet further comprises a plate that has a mounting surface and a plurality of contact pads that operably engages with the mounting surface of the plate. The plurality of contact pads is configured to apply pressure to predetermined positions of a die without the mounting surface of the plate contacting the die during a reflow process. The plate of the pressure collet is also formed of a first material and the plurality of contact pads are formed of a second material different than the first material.

公开(公告)号：US20140175675A1

公开(公告)日：2014-06-26

申请号：US14191592

申请日：2014-02-27

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Keith K. Sturcken ,  John A. Hughes ,  Thomas E. Love ,  Sheila J. Konecke ,  Jeffrey Montag ,  Peter M. Wallace

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  G01R31/003 ,  G01R31/2849 ,  G01R31/2855 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15331

Abstract: A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.

Abstract translation: 一种用于制造电子多芯片模块的方法，其包括堆叠至少六个被测试的装置以形成模块。 这些设备可以在组装电子模块之前单独测试。 在对设备进行单独测试之后，可以将设备堆叠在一起而形成具有至少六个堆叠设备的电子多芯片模块。 可以描述和要求保护其他实施例。