公开(公告)号：US20170308133A1

公开(公告)日：2017-10-26

申请号：US15637718

申请日：2017-06-29

Applicant: BEYOND BLADES LTD.

Inventor： AVIV SOFFER

IPC: G06F1/18 ,  G06F1/20 ,  H05K1/18 ,  H05K1/02 ,  F28D15/02 ,  H05K7/20

CPC classification number: G06F1/18 ,  F28D15/0266 ,  F28D15/0275 ,  G06F1/20 ,  G06F2200/1635 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0284 ,  H05K1/185 ,  H05K7/205 ,  H05K2201/041 ,  H01L2924/00

Abstract: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.

公开(公告)号：US20160044779A1

公开(公告)日：2016-02-11

申请号：US14886606

申请日：2015-10-19

Applicant: BEYOND BLADES LTD.

Inventor： AVIV SOFFER

IPC: H05K1/02 ,  H05K1/18

CPC classification number: G06F1/18 ,  F28D15/0266 ,  F28D15/0275 ,  G06F1/20 ,  G06F2200/1635 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0284 ,  H05K1/185 ,  H05K7/205 ,  H05K2201/041 ,  H01L2924/00

Abstract: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.