公开(公告)号：US20040028327A1

公开(公告)日：2004-02-12

申请号：US10620348

申请日：2003-07-17

Applicant: BinOptics Corporation

Inventor： Alex Behfar ,  Alfred T. Schremer ,  Cristian B. Stagarescu

IPC: G02B006/26 ,  G02B006/42 ,  G02B006/10

CPC classification number: G02B6/12002 ,  B81B2201/047 ,  B81C99/008 ,  B81C2201/0159 ,  G02B6/13 ,  G02B6/4204 ,  G02B6/4249 ,  G03F7/0037 ,  Y10S438/948 ,  Y10S438/949 ,  Y10S438/95

Abstract: Three-dimensional structures of arbitrary shape are fabricated on the surface of a substrate through a series of processing steps wherein a monolithic structure is fabricated in successive layers. A first layer of photoresist material is spun onto a substrate surface and is exposed in a desired pattern corresponding to the shape of a final structure, at a corresponding cross-sectional level in the structure. The layer is not developed after exposure; instead, a second layer of photoresist material is deposited and is also exposed in a desired pattern. Subsequent layers are spun onto the top surface of prior layers and exposed, and upon completion of the succession of layers each defining corresponding levels of the desired structure, the layers are all developed at the same time leaving the three-dimensional structure.

Abstract translation: 通过一系列处理步骤在基板的表面上制造任意形状的三维结构，其中单片结构以连续的层制造。 将第一层光致抗蚀剂材料旋转到基底表面上，并以对应于最终结构的形状的所需图案以结构中相应的横截面水平曝光。 暴露后层不发达; 相反，沉积第二层光致抗蚀剂材料并且也以期望的图案曝光。 随后的层被旋转到现有层的顶部表面上并暴露，并且在完成相继层级的各层限定所需结构的相应水平时，所有层都同时显现出离开三维结构。

公开(公告)号：US20030054578A1

公开(公告)日：2003-03-20

申请号：US09955123

申请日：2001-09-19

Applicant: BinOptics Corporation

Inventor： Alex Behfar ,  Alfred T. Schremer ,  Cristian B. Stagarescu

IPC: H01L021/66 ,  G01R031/26 ,  H01L021/31 ,  H01L021/469 ,  H01L033/00

CPC classification number: G02B6/12002 ,  B81B2201/047 ,  B81C99/008 ,  B81C2201/0159 ,  G02B6/13 ,  G02B6/4204 ,  G02B6/4249 ,  G03F7/0037 ,  Y10S438/948 ,  Y10S438/949 ,  Y10S438/95

Abstract: Three-dimensional structures of arbitrary shape are fabricated on the surface of a substrate through a series of processing steps wherein a monolithic structure is fabricated in successive layers. A first layer of photoresist material is spun onto a substrate surface and is exposed in a desired pattern corresponding to the shape of a final structure, at a corresponding cross-sectional level in the structure. The layer is not developed after exposure; instead, a second layer of photoresist material is deposited and is also exposed in a desired pattern. Subsequent layers are spun onto the top surface of prior layers and exposed, and upon completion of the succession of layers each defining corresponding levels of the desired structure, the layers are all developed at the same time leaving the three-dimensional structure.

Abstract translation: 通过一系列处理步骤在基板的表面上制造任意形状的三维结构，其中单片结构以连续的层制造。 将第一层光致抗蚀剂材料旋转到基底表面上，并以对应于最终结构的形状的所需图案以结构中相应的横截面水平曝光。 暴露后层不发达; 相反，沉积第二层光致抗蚀剂材料并且也以期望的图案曝光。 随后的层被旋转到现有层的顶部表面上并暴露，并且在完成相继层级的各层限定所需结构的相应水平时，所有层都同时显现出离开三维结构。