公开(公告)号：US20170303391A1

公开(公告)日：2017-10-19

申请号：US15518135

申请日：2015-10-22

Applicant: CANON KABUSHIKI KAISHA

Inventor： Jin MIYASAKA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0245 ,  H05K1/0228 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/09245 ,  H05K2201/10159

Abstract: Provided is a printed circuit board including a first semiconductor device and a second semiconductor device mounted on a printed wiring board, the printed wiring board including a first and a second differential signal wirings each formed of a pair of signal transmission lines. The pair of signal transmission lines forming the first differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the first differential signal wiring in a wiring direction thereof. The pair of signal transmission lines forming the second differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the second differential signal wiring in a wiring direction thereof.