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公开(公告)号：US10716211B2
公开(公告)日：2020-07-14
申请号：US16264401
申请日：2019-01-31
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takashi Numagi , Shoji Matsumoto , Hiroyuki Yamaguchi , Youhei Tazawa
Abstract: A printed wiring board includes a plurality of first wirings and a plurality of second wirings. The plurality of first wirings each include a first via conductor disposed outside a first region, a second region, and a third region in a plan view, and a first conductor pattern extending from the first via conductor to the first region. The plurality of second wirings each include a second via conductor disposed outside the first region, the second region, and the third region, and a second conductor pattern extending from the second via conductor to the first region. A fourth region overlaps with a fifth region in the plan view, the fourth region being a region in which a plurality of first conductor patterns are disposed, the fifth region being a region in which a plurality of second conductor patterns are disposed.
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公开(公告)号：US12219246B2
公开(公告)日：2025-02-04
申请号：US18316253
申请日：2023-05-12
Applicant: CANON KABUSHIKI KAISHA
Inventor： Nobuaki Yamashita , Takuya Kondo , Takashi Numagi
Abstract: An electric circuit includes a first power-supply line, a second power-supply line, a ground line, a first circuit, a second circuit, an RC series circuit, a capacitor, and a noise filter. The first circuit is configured to be electrically connected to the first power-supply line via a first power-supply terminal and electrically connected to the ground line via a first ground terminal. The second circuit is configured to be electrically connected to the second power-supply line via a second power-supply terminal and electrically connected to the ground line via a second ground terminal. The RC series circuit is disposed between the first power-supply terminal and the first ground terminal. The capacitor is disposed between the second power-supply terminal and the second ground terminal. The noise filter is disposed between the first power-supply line and the second power-supply line.
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公开(公告)号：US11689801B2
公开(公告)日：2023-06-27
申请号：US17703440
申请日：2022-03-24
Applicant: CANON KABUSHIKI KAISHA
Inventor： Nobuaki Yamashita , Takuya Kondo , Takashi Numagi
Abstract: An electric circuit includes a first power-supply line, a second power-supply line, a ground line, a first circuit, a second circuit, an RC series circuit, a capacitor, and a noise filter. The first circuit is configured to be electrically connected to the first power-supply line via a first power-supply terminal and electrically connected to the ground line via a first ground terminal. The second circuit is configured to be electrically connected to the second power-supply line via a second power-supply terminal and electrically connected to the ground line via a second ground terminal. The RC series circuit is disposed between the first power-supply terminal and the first ground terminal. The capacitor is disposed between the second power-supply terminal and the second ground terminal. The noise filter is disposed between the first power-supply line and the second power-supply line.
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公开(公告)号：US10306761B2
公开(公告)日：2019-05-28
申请号：US15825563
申请日：2017-11-29
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takashi Numagi , Youhei Tazawa , Shoji Matsumoto
Abstract: Provided is a printed wiring board including: a plurality of inner layers including a ground layer and a power supply layer; and a plurality of ground vias and a plurality of power supply vias each provided to penetrate at least the ground layer and the power supply layer in a thickness direction of the printed wiring board, a ground potential being applied to the plurality of ground vias at the ground layer, and a power supply potential being applied to the plurality of power supply vias at the power supply layer. In a top view from a direction perpendicular to the printed wiring board, a distance between vias to which the same potential is applied is shorter than a distance between vias to which different potentials are applied.
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5.发明授权公开(公告)号：US11480910B2
公开(公告)日：2022-10-25
申请号：US16893506
申请日：2020-06-05
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takashi Numagi , Kunihiko Uchida
Abstract: A printed circuit board includes a printed wiring board, and a first element and a second element mounted on the printed wiring board. The printed wiring board includes a plurality of first signal lines and a plurality of second signal lines. The plurality of first signal lines each include a first main line, a first branch line, and a second branch line. The plurality of second signal lines each include a second main line, a third branch line, and a fourth branch line. The first branch line includes a first conductor pattern disposed in a first conductor layer. The second branch line includes a second conductor pattern disposed in the first conductor layer. The third branch line includes a third conductor pattern disposed in a second conductor layer. The fourth branch line includes a fourth conductor pattern disposed in the second conductor layer.
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Patent Agency Ranking
公开(公告)号：US20220321781A1
公开(公告)日：2022-10-06
申请号：US17703440
申请日：2022-03-24
Applicant: CANON KABUSHIKI KAISHA
Inventor： Nobuaki Yamashita , Takuya Kondo , Takashi Numagi
Abstract: An electric circuit includes a first power-supply line, a second power-supply line, a ground line, a first circuit, a second circuit, an RC series circuit, a capacitor, and a noise filter. The first circuit is configured to be electrically connected to the first power-supply line via a first power-supply terminal and electrically connected to the ground line via a first ground terminal. The second circuit is configured to be electrically connected to the second power-supply line via a second power-supply terminal and electrically connected to the ground line via a second ground terminal. The RC series circuit is disposed between the first power-supply terminal and the first ground terminal. The capacitor is disposed between the second power-supply terminal and the second ground terminal. The noise filter is disposed between the first power-supply line and the second power-supply line.
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公开(公告)号：US20220304144A1
公开(公告)日：2022-09-22
申请号：US17694070
申请日：2022-03-14
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takuya Kondo , Takashi Numagi , Nobuaki Yamashita
Abstract: An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.
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公开(公告)号：US11792917B2
公开(公告)日：2023-10-17
申请号：US17694070
申请日：2022-03-14
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takuya Kondo , Takashi Numagi , Nobuaki Yamashita
CPC classification number: H05K1/0231 , H01L25/162 , H05K1/0225 , H05K1/148 , H05K2201/09227 , H05K2201/1003 , H05K2201/1006 , H05K2201/10015 , H05K2201/10378 , H05K2201/10545
Abstract: An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.
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公开(公告)号：US20190246498A1
公开(公告)日：2019-08-08
申请号：US16264401
申请日：2019-01-31
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takashi Numagi , Shoji Matsumoto , Hiroyuki Yamaguchi , Youhei Tazawa
Abstract: A printed wiring board includes a plurality of first wirings and a plurality of second wirings. The plurality of first wirings each include a first via conductor disposed outside a first region, a second region, and a third region in a plan view, and a first conductor pattern extending from the first via conductor to the first region. The plurality of second wirings each include a second via conductor disposed outside the first region, the second region, and the third region, and a second conductor pattern extending from the second via conductor to the first region. A fourth region overlaps with a fifth region in the plan view, the fourth region being a region in which a plurality of first conductor patterns are disposed, the fifth region being a region in which a plurality of second conductor patterns are disposed.
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公开(公告)号：US09894751B2
公开(公告)日：2018-02-13
申请号：US14944540
申请日：2015-11-18
Applicant: CANON KABUSHIKI KAISHA
Inventor： Yusuke Murai , Shoji Matsumoto , Takashi Numagi , Hiroyuki Yamaguchi , Nobuaki Yamashita
CPC classification number: H05K1/0225 , H05K1/0231 , H05K1/0234 , H05K1/115
Abstract: First and second semiconductor devices and first and second bypass circuits are mounted on a printed wiring board. The first bypass circuit and the second bypass circuit are provided closer to the first semiconductor device and to the second semiconductor device, respectively. The first bypass circuit has one end connected to a power plane through a first power supply via and the other end connected to a ground plane through a first ground via. The second bypass circuit has one end connected to the power plane through a second power supply via and the other end connected to the ground plane through a second ground via. The ground plane has a slit between the connecting portions of the first and second ground vias to increase the impedance between the connecting portions of the first and the second ground vias. Thus, jitters caused by power supply noise can be reduced.
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