公开(公告)号：US10462897B2

公开(公告)日：2019-10-29

申请号：US15923442

申请日：2018-03-16

Applicant: CARNEGIE MELLON UNIVERSITY

Inventor： Gary K. Fedder ,  Carmel Majidi ,  Philip R. LeDuc ,  Lee E. Weiss ,  Christopher J. Bettinger ,  Naser Naserifar

IPC: H05K1/02 ,  B29C33/40 ,  H01L21/48 ,  H05K1/18 ,  H05K3/30 ,  H05K3/38 ,  H05K3/46 ,  H05K5/06 ,  B05D3/10 ,  H01L23/31

Abstract: A flexible and stretchable integrated electronic device comprising a substrate having a stiffness gradient, wherein a rigid electronic device is embedded within the substrate. The stiffness gradient within the substrate prevents delamination at the interface between the substrate and the embedded device. A method of fabricating an integrated electronic device having a stiffness gradient comprises applying a curing agent to an uncured polymer base material.

公开(公告)号：US20200029428A1

公开(公告)日：2020-01-23

申请号：US16572652

申请日：2019-09-17

Applicant: CARNEGIE MELLON UNIVERSITY

Inventor： Gary K. Fedder ,  Carmel Majidi ,  Philip R. LeDuc ,  Lee E. Weiss ,  Christopher J. Bettinger ,  Naser Naserifar

IPC: H05K1/02 ,  B29C33/40 ,  H01L21/48 ,  H05K1/18 ,  H05K3/30 ,  H05K3/38 ,  H05K3/46

Abstract: A flexible and stretchable integrated electronic device comprising a substrate having a stiffness gradient, wherein a rigid electronic device is embedded within the substrate. The stiffness gradient within the substrate prevents delamination at the interface between the substrate and the embedded device. A method of fabricating an integrated electronic device having a stiffness gradient comprises applying a curing agent to an uncured polymer base material.

公开(公告)号：US12096553B2

公开(公告)日：2024-09-17

申请号：US16572652

申请日：2019-09-17

Applicant: CARNEGIE MELLON UNIVERSITY

Inventor： Gary K. Fedder ,  Carmel Majidi ,  Philip R. LeDuc ,  Lee E. Weiss ,  Christopher J. Bettinger ,  Naser Naserifar

IPC: H05K1/02 ,  B29C33/40 ,  H01L21/48 ,  H05K1/18 ,  H05K3/30 ,  H05K3/38 ,  H05K3/46 ,  B05D3/10 ,  H01L23/31 ,  H05K5/06

CPC classification number: H05K1/0283 ,  B29C33/40 ,  H01L21/4803 ,  H05K1/02 ,  H05K1/185 ,  H05K3/30 ,  H05K3/38 ,  H05K3/4644 ,  A61B2562/125 ,  A61B2562/164 ,  B05D3/10 ,  B05D3/107 ,  B05D3/108 ,  H01L23/3121 ,  H05K5/065 ,  H05K2201/1003

Abstract: A flexible and stretchable integrated electronic device includes a substrate having a stiffness gradient, wherein a rigid electronic device is embedded within the substrate. The stiffness gradient within the substrate prevents delamination at the interface between the substrate and the embedded device. The stiffness gradient is accomplished by providing at least two distinct zones in the substrate with uniform stiffness, with each zone decreasing in stiffness as in a distance from the embedded device increases, or the gradient is accomplished by having a zone with a varying stiffness.

公开(公告)号：US20180206336A1

公开(公告)日：2018-07-19

申请号：US15923442

申请日：2018-03-16

Applicant: CARNEGIE MELLON UNIVERSITY

Inventor： Gary K. Fedder ,  Carmel Majidi ,  Philip R. LeDuc ,  Lee E. Weiss ,  Christopher J. Bettinger ,  Naser Naserifar

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K3/38

CPC classification number: H05K1/0283 ,  A61B2562/125 ,  A61B2562/164 ,  B05D3/10 ,  B05D3/107 ,  B05D3/108 ,  B29C33/40 ,  H01L21/4803 ,  H01L23/3121 ,  H05K1/02 ,  H05K1/185 ,  H05K3/30 ,  H05K3/38 ,  H05K3/4644 ,  H05K5/065 ,  H05K2201/1003

Abstract: A flexible and stretchable integrated electronic device comprising a substrate having a stiffness gradient, wherein a rigid electronic device is embedded within the substrate. The stiffness gradient within the substrate prevents delamination at the interface between the substrate and the embedded device. A method of fabricating an integrated electronic device having a stiffness gradient comprises applying a curing agent to an uncured polymer base material.