公开(公告)号：US20250095917A1

公开(公告)日：2025-03-20

申请号：US18885815

申请日：2024-09-16

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： CHUN-CHIH LIN ,  HSIN HSIEN YEH

IPC: H01F41/10 ,  H01F27/28 ,  H01F27/29 ,  H01F27/30 ,  H01F41/06

Abstract: An inductive component and a method for fabricating the same are provided. The method includes: filling a mold with a first magnetic powder to form a base layer; forming a cavity in the base layer; inserting a coil corresponding to the cavity; filling the mold with a second magnetic powder to form a cover layer, in which the cover layer fills a space between the cavity and the corresponding coil and covers the base layer and the coil; executing a compression molding process to form a to-be-sliced package and taking the to-be-sliced package out; slicing the to-be-sliced package to obtain a to-be-packaged body; and forming a protective layer and an electrode part electrically connected to the coil on a surface of the to-be-packaged body.

公开(公告)号：US20240194388A1

公开(公告)日：2024-06-13

申请号：US18317891

申请日：2023-05-15

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： CHAU-CHYUN CHUNG ,  CHI-FENG LI ,  HSIN HSIEN YEH

IPC: H01F27/255 ,  H01F27/28 ,  H01F41/02

CPC classification number: H01F27/255 ,  H01F27/28 ,  H01F41/0246

Abstract: A composite inductor includes a coil structure and a magnetic packaging structure. The coil structure has a through hole, and the coil structure is embedded in the magnetic packaging structure. The magnetic packaging structure contains at least a first magnetic body and a second magnetic body. Based on a total thickness of the magnetic packaging structure being 100%, a thickness of each of the first magnetic body and the second magnetic body is higher than or equal to 16%.

公开(公告)号：US20210383954A1

公开(公告)日：2021-12-09

申请号：US17334877

申请日：2021-05-31

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： CHIA-CHEN CHEN ,  YU-CHENG CHANG ,  HSIN HSIEN YEH

IPC: H01F17/04 ,  H01F3/08 ,  H01F27/02 ,  H01F27/28 ,  H01F41/02

Abstract: An inductive device and a manufacturing method thereof are provided. The inductive device includes a magnetic base, a coil structure, and a package structure. The magnetic base has an assembling surface, and an arrangement region is defined thereon. The coil structure is assembled to the magnetic base and includes a coil body, a first extending section, and a second extending section. The coil body has a though hole corresponding in position to the arrangement region, and the first and second extending sections both extend from the coil body toward the magnetic base and are wound on the magnetic base. The package structure covers the magnetic base and the coil structure. The package structure includes a magnetic molding main body, and a portion of the magnetic molding main body fills into the through hole of the coil body and is connected to the magnetic base.