公开(公告)号：US11800633B2

公开(公告)日：2023-10-24

申请号：US17523018

申请日：2021-11-10

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： Hung-Chih Liang ,  Pin-Yu Chen ,  Hsiu-Fa Yeh ,  Hang-Chun Lu ,  Ya-Wan Yang ,  Yu-Ting Hsu

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K2201/1003 ,  H05K2201/10416

Abstract: An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.