-
公开(公告)号：US20250071895A1
公开(公告)日：2025-02-27
申请号：US18768605
申请日：2024-07-10
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chih-Hsiung Hu , Chun-Te Lee , Shyh-Jen Guo
IPC: H05K1/03
Abstract: A flexible circuit tape includes flexible circuit boards each including a substrate unit and a circuit unit. The circuit unit is disposed on a routing region of the substrate unit and includes circuit lines each having an inner lead and an outer lead. A second width between the two outermost outer leads accounts for 60.00-99.00% of a first width of the substrate unit. The first width is greater than or equal to 80 mm such that number of outer leads can be increased.
Search Results
1
records
(took 0.012 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
